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US 6,407,360 B1Granted
Laser cutting apparatus and method
AssigneeSamsung Electronics Co., Ltd.
InventorsDae-ho Choo, Byeong-ill Kim, Sung-uk Jung, Woo-shik Lee, Bum-soo Kim
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Abstract
A laser cutter for cutting an object being cut such as a two glasses-attached panel for LCD using a laser beam. The laser cutter includes a laser unit for irradiating a laser beam with a specific wavelength along a marked cutting line of the object, a pre-scriber for forming a pre-cut groove at starting edge of the marked cutting line, and a cooling unit for cooling the cutting line which said laser beam has been irradiated. The pre-scriber can be a rotating blade.
Claims15
A laser cutter, comprising:
- a laser unit for irradiating a laser beam with a specific wavelength along a cutting line of a target object being cut;
- means for forming a pre-cut groove at a selected portion of the cutting line;
- a cooling unit that supplies a coolant to the target object along the cutting line on which the laser beam has been irradiated;
- and
- a coolant inhaler for inhaling a coolant supplied to the target object,
- wherein said means for forming a pre-cut groove comprises:
- a first rod disposed in front of traveling direction of said laser unit;
- a second rod pivotally coupled to said first rod, said second rod rotating clockwise or counterclockwise;
- and
- a rotating blade coupled to one-sided end of said second rod, for forming a pre-cut groove at a selected portion of the cutting line of the object being cut.
7 more elements
Dependencies are inferred from the claim text.