Grinding method
AssigneeHitachi, Ltd.
InventorTsutomu Mimata
Life of this patent
Estimating the term…
Abstract
A method for segmenting a plate-like material, particularly a semiconductor wafer on which a plurality of elements are formed in regular arrangement, is provided. Segmentation is performed while flowing a fluid over the entire surface of the plate-like material to wash the surface thereof.
Claims10
A method for segmenting a plate-like material into a plurality of individual pellets comprising the steps of:
- a. forming grooves in the surface of said plate-like material by scribing said surface with a rotating grinder blade while causing washing fluid to flow over the entire surface of said plate-like material;
- and
- b. simultaneously with step (a), spraying a cooling fluid at the contact portion of said blade and the groove surface portion of said plate-like material.
In an apparatus for segmenting a plate-like material into a plurality of individual pellets having a rotating grinder blade forming grooves in the surface of said plate-like material and first means for supplying a cooling fluid thereto, the improvement comprising:
- second means, disposed adjacent to said plate-like material, for causing washing fluid to flow over the entire surface of said plate-like material simultaneously with the supplying of cooling fluid by said first means, to thereby completely wash away cuttings from the surface of said plate-like material.
Dependencies are inferred from the claim text.