B28D 5/0082
For supporting, holding, feeding, conveying or discharging work
Official title: {for supporting, holding, feeding, conveying or discharging work}
B28D5/0082 (For supporting, holding, feeding, conveying or discharging work) appears on 352 US grants and 291 published applications in this corpus.
Search patents in B28D- Granted patents
- 352
- Published applications
- 291
- Assignees
- 205
- Inventors
- 798
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 2 | 0 |
| 1978 | 2 | 0 |
| 1979 | 1 | 0 |
| 1980 | 3 | 0 |
| 1981 | 3 | 0 |
| 1982 | 3 | 0 |
| 1983 | 2 | 0 |
| 1984 | 2 | 0 |
| 1985 | 1 | 0 |
| 1986 | 2 | 0 |
| 1987 | 6 | 0 |
| 1988 | 3 | 0 |
| 1989 | 4 | 0 |
| 1990 | 7 | 0 |
| 1991 | 2 | 0 |
| 1992 | 4 | 0 |
| 1993 | 2 | 0 |
| 1994 | 2 | 0 |
| 1995 | 4 | 0 |
| 1996 | 3 | 0 |
| 1997 | 3 | 0 |
| 1998 | 9 | 0 |
| 1999 | 18 | 0 |
| 2000 | 24 | 0 |
| 2001 | 22 | 7 |
| 2002 | 24 | 13 |
| 2003 | 10 | 8 |
| 2004 | 10 | 13 |
| 2005 | 6 | 10 |
| 2006 | 9 | 11 |
| 2007 | 6 | 13 |
| 2008 | 4 | 16 |
| 2009 | 4 | 9 |
| 2010 | 4 | 15 |
| 2011 | 13 | 17 |
| 2012 | 14 | 9 |
| 2013 | 6 | 10 |
| 2014 | 7 | 8 |
| 2015 | 12 | 11 |
| 2016 | 4 | 6 |
| 2017 | 5 | 6 |
| 2018 | 6 | 8 |
| 2019 | 9 | 16 |
| 2020 | 10 | 12 |
| 2021 | 12 | 18 |
| 2022 | 11 | 17 |
| 2023 | 5 | 8 |
| 2024 | 8 | 11 |
| 2025 | 10 | 16 |
| 2026 | 7 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Manufacturing method of gallium nitride substrate22 Sep 2026US 12,741,340 B2Disco Corporation
- Cutting apparatus, tray, and transport system30 Jun 2026US 12,672,506 B2Disco Corporation
- ASC process automation device16 Jun 2026US 12,660,548 B2SK Siltron Co., Ltd.
- Lower jacking member, wire withdrawal method, and squaring machine12 May 2026US 12,623,374 B2Fuzhou Skywiretech Co.,Ltd.
- Methods for controlling wafer breakage during ingot slicing operations21 Apr 2026US 12,605,863 B2GlobalWafers Co., Ltd.
- Method for simultaneously slicing a multiplicity of slices from a workpiece by means of a wire saw1 Oct 2026US 2026/0295901 A1
- Cutting apparatus, cutting method, and method for manufacturing cut product30 Jul 2026US 2026/0216919 A1Towa Corporation
- Silicon Rod Cutting System7 May 2026US 2026/0124789 A1Qingdao Gaoce Technology Co., Ltd
- Cutting method and manufacturing method for chip9 Oct 2025US 2025/0312944 A1Disco Corporation
- System and method for slicing workpiece2 Oct 2025US 2025/0303613 A1CompTake Technology Inc.
Most cited
By later US patents
- Method and device for simultaneously cutting off a multiplicity of wafers from a workpiece174US 6,295,977 B1Wacker Chemie AG · 2001
- Method and apparatus for targetless wafer alignment123US 4,328,553 AComputervision Corporation · 1982
- Nozzle for cleaving substrates71US 6,263,941 B1Silicon Genesis Corporation · 2001
- Substrate cleaving tool and method70US 6,221,740 B1Silicon Genesis Corporation · 2001
- Nozzle for cleaving substrates68US 6,513,564 B2Silicon Genesis Corporation · 2003