B28D 5/0088
The supporting or holding device being angularly adjustable
Official title: {the supporting or holding device being angularly adjustable}
B28D5/0088 (The supporting or holding device being angularly adjustable) appears on 37 US grants and 35 published applications in this corpus.
Search patents in B28D- Granted patents
- 37
- Published applications
- 35
- Assignees
- 32
- Inventors
- 86
- Latest grant
- 15 Apr 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 2 | 0 |
| 1999 | 4 | 0 |
| 2000 | 3 | 0 |
| 2001 | 1 | 0 |
| 2002 | 1 | 3 |
| 2003 | 1 | 1 |
| 2004 | 1 | 5 |
| 2005 | 2 | 2 |
| 2006 | 3 | 1 |
| 2007 | 1 | 1 |
| 2008 | 0 | 2 |
| 2009 | 1 | 1 |
| 2010 | 0 | 1 |
| 2011 | 1 | 2 |
| 2012 | 2 | 0 |
| 2013 | 0 | 1 |
| 2014 | 0 | 2 |
| 2015 | 2 | 4 |
| 2016 | 1 | 0 |
| 2017 | 0 | 0 |
| 2018 | 2 | 1 |
| 2019 | 0 | 2 |
| 2020 | 2 | 0 |
| 2021 | 1 | 1 |
| 2022 | 0 | 1 |
| 2023 | 1 | 1 |
| 2024 | 0 | 1 |
| 2025 | 1 | 1 |
| 2026 | 0 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Workplate for Y-axis compensation of ingot and Y-axis compensation method of ingot using the same15 Apr 2025US 12,275,165 B2SK Siltron Co., Ltd.
- Method for machining workpiece21 Feb 2023US 11,587,831 B2Disco Corporation
- Diamond wire cutting method for crystal boules4 May 2021US 10,994,443 B2Comadur SA
- Apparatus for dividing workpiece27 Oct 2020US 10,818,523 B2Disco Corporation
- Workpiece holder and method for slicing workpiece24 Mar 2020US 10,596,724 B2Shin-Etsu Handotai Co., Ltd.
- Method for simultaneously slicing a multiplicity of slices from a workpiece by means of a wire saw1 Oct 2026US 2026/0295901 A1
- Cutting method and manufacturing method for chip9 Oct 2025US 2025/0312944 A1Disco Corporation
- Cutting Device of Silicon Rod Cutting System, and Silicon Rod Cutting System19 Dec 2024US 2024/0416557 A1Qingdao Gaoce Technology Co., Ltd
- Workplate for y-axis compensation of ingot and y-axis compensation method of ingot using the same13 Jul 2023US 2023/0219258 A1SK Siltron Co., Ltd.
- Method and apparatus for manufacturing high-hardness diamond simulant by cutting a gemstone into 100-sided body3 Mar 2022US 2022/0063135 A1Dia S.R.L.
Most cited
By later US patents
- Process for the orientation of several single crystals disposed side by side on a cutting support for their simultaneous cutting in a cutting machine and device for practicing this process31US 5,839,424 AHCT Shaping System SA · 1998
- Wire saw and slicing method thereof26US 5,904,136 ATokyo Seimitsu Co., Ltd. · 1999
- Cutting device with wires26US 5,913,305 AHCT Shaping Systems SA · 1999
- Method of positioning work piece and system therefor22US 5,893,308 ATokyo Seimitsu Co., Ltd. · 1999
- Process for the orientation of single crystals for cutting in a cutting machine and device for practicing this process21US 5,720,271 A1998