Method for machining workpiece

A method for machining a workpiece including a substrate that has a front surface and a back surface and a ductile material layer that contains a ductile material having ductility and is disposed on the front surface or the back surface of the substrate, the method comprising:

• a tape bonding step of bonding a tape on a side of the substrate of the workpiece;
• a holding step of holding the workpiece by a holding table via the tape such that the ductile material layer is exposed;
• and
• a cutting step of, after performing the holding step, relatively moving the holding table and a cutting blade to cause the cutting blade to cut into the ductile material layer and the substrate, so that the workpiece is cut,
• wherein in the cutting step, the cutting blade is rotated such that a portion of the cutting blade, the portion being located on a forward side in a moving direction of the cutting blade relative to the holding table, cuts into the workpiece from the ductile material layer toward the substrate.