Workpiece holder and method for slicing workpiece
AssigneeShin-Etsu Handotai Co., Ltd.
InventorShiroyasu Watanabe
Life of this patent
Estimating the term…
Loading patent…
AssigneeShin-Etsu Handotai Co., Ltd.
InventorShiroyasu Watanabe
Estimating the term…
A workpiece holder for slicing the workpiece by a wire saw including a workpiece plate which is bonded and fixed to the workpiece through a pad plate, and a holder main body which supports the workpiece plate. The workpieces at an x axis direction and a direction vertical to the same is a y axis direction, the workpiece plate is bonded and fixed to the workpiece to correct a deviation of a crystal orientation axis of the workpiece in the x axis direction. The workpiece holder can adjust a tilt in the y axis direction of the workpiece by tilting the workpiece plate in the y axis direction. The workpiece holder can realize slicing an ingot conforming to specifications with rigorous orientation standards in an external setup manner without using a wire saw including an orientation adjustment mechanism for a single crystal ingot, and a method for slicing a workpiece.
A workpiece holder which is used to hold a workpiece made of a columnar single crystal at the time of slicing the workpiece by a wire saw, comprising:
A method for slicing a workpiece, comprising pressing a workpiece made of a columnar single crystal held by a workpiece holder against a wire row of a wire saw to slice the workpiece with the use of the wire saw comprising the wire row formed by winding a wire which reciprocatively travels in an axial direction around a plurality of grooved rollers,
Dependencies are inferred from the claim text.