B28D 5/0064
Devices for the automatic drive or the program control of the machines
Official title: {Devices for the automatic drive or the program control of the machines}
B28D5/0064 (Devices for the automatic drive or the program control of the machines) appears on 122 US grants and 149 published applications in this corpus.
Search patents in B28D- Granted patents
- 122
- Published applications
- 149
- Assignees
- 79
- Inventors
- 347
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 4 | 0 |
| 2001 | 7 | 1 |
| 2002 | 5 | 6 |
| 2003 | 4 | 1 |
| 2004 | 2 | 4 |
| 2005 | 1 | 5 |
| 2006 | 1 | 2 |
| 2007 | 7 | 8 |
| 2008 | 4 | 1 |
| 2009 | 2 | 4 |
| 2010 | 0 | 6 |
| 2011 | 4 | 5 |
| 2012 | 6 | 4 |
| 2013 | 3 | 5 |
| 2014 | 1 | 3 |
| 2015 | 4 | 0 |
| 2016 | 0 | 4 |
| 2017 | 4 | 3 |
| 2018 | 1 | 7 |
| 2019 | 4 | 6 |
| 2020 | 3 | 9 |
| 2021 | 8 | 10 |
| 2022 | 7 | 14 |
| 2023 | 6 | 13 |
| 2024 | 10 | 11 |
| 2025 | 12 | 11 |
| 2026 | 7 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Systems and methods for controlling surface profiles of wafers sliced in a wire saw22 Sep 2026US 12,741,397 B2GlobalWafers Co., Ltd.
- Methods for compensating for crystal structure differential material removal rates in sub-aperture figuring processes28 Jul 2026US 12,691,548 B2Corning Incorporated
- Lower jacking member, wire withdrawal method, and squaring machine12 May 2026US 12,623,374 B2Fuzhou Skywiretech Co.,Ltd.
- Monocrystalline SiC substrates having an asymmetrical geometry and method of producing same12 May 2026US 12,628,388 B2SiCrystal GmbH
- Monocrystalline SiC Substrates Having an Asymmetrical Geometry and Method of Producing Same27 Aug 2026US 2026/0255640 A1SiCrystal GmbH
- Band saw cutting machine20 Aug 2026US 2026/0241610 A1Nachi-Fujikoshi Corp.
- Laser-assisted method for parting crystalline material6 Aug 2026US 2026/0225180 A1Wolfspeed, Inc.
- Cutting apparatus, cutting method, and method for manufacturing cut product30 Jul 2026US 2026/0216919 A1Towa Corporation
- Spindle apparatus and cutting apparatus for semiconductor package14 May 2026US 2026/0131504 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Nozzle for cleaving substrates71US 6,263,941 B1Silicon Genesis Corporation · 2001
- Substrate cleaving tool and method70US 6,221,740 B1Silicon Genesis Corporation · 2001
- Nozzle for cleaving substrates68US 6,513,564 B2Silicon Genesis Corporation · 2003
- Monitoring system for dicing saws42US 6,033,288 AKulicke & Soffa Investments, Inc. · 2000
- Substrate cleaving tool and method33US 6,554,046 B1Silicon Genesis Corporation · 2003