Monitoring system for dicing saws
AssigneeKulicke & Soffa Investments, Inc.
InventorsIlan Weisshaus, Oded Yehoshua Licht
Life of this patent
Estimating the term…
Abstract
A method and apparatus for accumulating dicing data for process analysis, monitoring process stability and cut quality in a substrate. The apparatus has a spindle motor with a blade attached to the spindle motor. A spindle driver is coupled the spindle to drive the spindle at a predetermined rotation rate. A sensor is connected to the spindle motor to determine the rotation rate of the spindle. A controller is coupled to the monitor in order to control the spindle driver responsive to the load induced on the blade by the substrate.
Claims28
A device for use with a dicing saw for monitoring process stability and a quality of cuts in a substrate, the device comprising:
- a motor having a spindle;
- a blade attached to the spindle;
- a spindle driver coupled to the spindle to drive the spindle;
- a sensor for determining a speed of the spindle;
- a monitor for determining a load placed on the blade by the substrate;
- and
- a controller coupled to the monitor for controlling the spindle driver responsive to the load.
A device for use with a dicing saw for monitoring process stability and a quality of kerfs in a substrate, the device comprising:
- a motor;
- a blade attached to the motor;
- a driver coupled to the motor to drive the motor;
- a sensor coupled to the motor for determining a rotation rate of the motor;
- a load monitor coupled to the motor for determining a load placed on the blade by the substrate;
- a controller receiving i) an output of the load monitor and ii) at least one control parameter for controlling the driver responsive to the load;
- and
- an operation circuit coupled to the controller and the sensor to provide a drive signal to the driver based on an output of the sensor and a control signal from the controller.
A device for monitoring process stability and a quality of kerfs cut in a substrate, the device comprising:
- rotating means for rotating a blade;
- rotation determining means for determining a rotation rate of the blade;
- load determining means for determining a load placed on the blade by the substrate;
- and
- control means for controlling the rotation rate of the blade responsive to the load.
A method for monitoring process stability and a quality of kerfs cut in a substrate, for use with a dicing saw having a spindle motor and a blade attached to the spindle motor, the method comprising the steps of:
- (a) rotating the blade attached to the spindle motor;
- (b) determining a speed of the spindle motor;
- (c) determining a load placed on the blade by the substrate;
- (d) providing operating parameters;
- and
- (e) controlling the speed of the spindle based on the operating parameters and responsive to the load placed on the blade by the substrate.
A device for use with a semiconductor dicing saw for monitoring process stability and a quality of cuts in a semiconductor substrate, the device comprising:
- a motor having a spindle;
- a blade attached to the spindle to cut the semiconductor substrate into a plurality of die;
- a spindle driver coupled to the spindle to drive the spindle;
- a sensor for determining a speed of the spindle;
- a monitor for determining a load placed on the blade by the substrate;
- and
- a controller coupled to the monitor for controlling the spindle driver responsive to the load.
A device for use with a dicing saw for monitoring process stability and a quality of cuts in a hard and brittle substrate, the device comprising:
- a motor having a spindle;
- a blade attached to the spindle to cut the substrate into a plurality of die;
- a spindle driver coupled to the spindle to drive the spindle;
- a sensor for determining a speed of the spindle;
- a monitor for determining a load placed on the blade by the substrate;
- and
- a controller coupled to the monitor for controlling the spindle driver responsive to the load.
Dependencies are inferred from the claim text.