B24B 9/065
Of thin, brittle parts
Official title: {of thin, brittle parts, e.g. semiconductors, wafers}
B24B9/065 (Of thin, brittle parts) appears on 381 US grants and 391 published applications in this corpus.
Search patents in B24B- Granted patents
- 381
- Published applications
- 391
- Assignees
- 174
- Inventors
- 790
- Latest grant
- 23 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 2 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 3 | 0 |
| 1989 | 4 | 0 |
| 1990 | 1 | 0 |
| 1991 | 7 | 0 |
| 1992 | 5 | 0 |
| 1993 | 2 | 0 |
| 1994 | 6 | 0 |
| 1995 | 7 | 0 |
| 1996 | 7 | 0 |
| 1997 | 4 | 0 |
| 1998 | 7 | 0 |
| 1999 | 11 | 0 |
| 2000 | 13 | 0 |
| 2001 | 26 | 10 |
| 2002 | 18 | 17 |
| 2003 | 15 | 11 |
| 2004 | 8 | 12 |
| 2005 | 15 | 12 |
| 2006 | 8 | 13 |
| 2007 | 11 | 19 |
| 2008 | 4 | 27 |
| 2009 | 5 | 32 |
| 2010 | 9 | 16 |
| 2011 | 13 | 16 |
| 2012 | 13 | 15 |
| 2013 | 10 | 9 |
| 2014 | 9 | 18 |
| 2015 | 16 | 21 |
| 2016 | 23 | 15 |
| 2017 | 13 | 17 |
| 2018 | 15 | 15 |
| 2019 | 11 | 10 |
| 2020 | 11 | 12 |
| 2021 | 10 | 11 |
| 2022 | 6 | 8 |
| 2023 | 6 | 12 |
| 2024 | 8 | 15 |
| 2025 | 8 | 16 |
| 2026 | 6 | 12 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Chip treating method23 Jun 2026US 12,666,923 B2Disco Corporation
- Chemical mechanical polishing apparatus16 Jun 2026US 12,660,542 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Substrate processing apparatus and substrate processing method12 May 2026US 12,623,313 B2Tokyo Electron Limited
- Chamfered silicon carbide substrate and method of chamfering21 Apr 2026US 12,610,792 B2SiCrystal GmbH
- Method of processing a wafer31 Mar 2026US 12,593,642 B2Disco Corporation
- Semiconductor wafer grinding device and grinding method10 Sep 2026US 2026/0264189 A1Tokyo Seimitsu Co., Ltd.
- Grinding device and semiconductor device manufacturing method10 Sep 2026US 2026/0271646 A1Kioxia Corporation
- Grinding stone truing method and truing device20 Aug 2026US 2026/0241514 A1Tokyo Seimitsu Co., Ltd.
- Polishing device13 Aug 2026US 2026/0233358 A1Ebara Corporation
- Device and method for truing grinding stone13 Aug 2026US 2026/0233359 A1Tokyo Seimitsu Co., Ltd.
Most cited
By later US patents
- Apparatus and method for chamfering wafer130US 6,267,648 B1Tokyo Seimitsu Co., Ltd. · 2001
- Method for manufacturing a magnetic disk including a glass substrate90US 6,363,599 B1Komag, Inc. · 2002
- Method for apparatus for polishing outer peripheral chamfered part of wafer86US 6,884,154 B2Shin-Etsu Handotai Co., Ltd. · 2005
- Method and apparatus for wafer chamfer polishing59US 6,234,879 B1Shin-Etsu Handotai Co., Ltd. · 2001
- Method for manufacturing a magnetic disk comprising a glass substrate using a protective layer over a glass workpiece55US 6,718,612 B2Asahi Glass Company, Limited · 2004