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US 2026/0271646 A1Published application
Grinding device and semiconductor device manufacturing method
AssigneeKioxia Corporation
InventorTomonori KAWASAKI
Life of this patent
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Abstract
A grinding device includes a blade having a disc shape, configured to grind an outer peripheral portion of a semiconductor substrate that rotates with respect to a first axis, and rotating with respect to a second axis, the first axis intersecting the second axis. The blade has a blade face including an outer peripheral edge portion that comes into contact with the outer peripheral portion of the semiconductor substrate. At least the outer peripheral edge portion of the blade face is inclined to the first axis.
Claims15
A grinding device, comprising:
- a blade having a disc shape, configured to grind an outer peripheral portion of a semiconductor substrate that rotates with respect to a first axis, and rotating with respect to a second axis, the first axis intersecting the second axis, wherein
- the blade has a blade face including an outer peripheral edge portion that comes into contact with the outer peripheral portion of the semiconductor substrate, and
- at least the outer peripheral edge portion of the blade face is inclined to the first axis.
A semiconductor device manufacturing method, comprising:
- grinding, with a blade, an outer peripheral portion of a semiconductor substrate that rotates with respect to a first axis;
- wherein the blade rotates with respect to a second axis, the first axis intersecting the second axis;
- wherein the blade has a blade face including an outer peripheral edge portion that comes into contact with the outer peripheral portion of the semiconductor substrate, and at least the outer peripheral edge portion of the blade face is inclined to the first axis.
Dependencies are inferred from the claim text.