Grinding stone truing method and truing device
AssigneeTokyo Seimitsu Co., Ltd.
InventorTaira TSURU
Life of this patent
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Abstract
A grinding stone truing method for a grinding stone 16 for use in a device for chamfering a wafer, the grinding stone truing method including: determining a target shape of the grinding stone 16; and truing the grinding stone 16 to achieve the target shape, based on respective shapes of a truer 10 and the grinding stone 16 measured at least before machining and a displacement condition indicating a relationship in applied force and displacement between the truer 10 and the grinding stone 16.
Claims9
1-8. (canceled)
A grinding stone truing method for a grinding stone for use in a device for chamfering a wafer, the grinding stone truing method comprising:
- determining a target shape of the grinding stone;
- and
- truing the grinding stone to achieve the target shape while controlling an incision amount, a rotational rate, and a position of a truer to the grinding stone, based on respective shapes of the truer and the grinding stone measured at least before machining and a displacement condition indicating a relationship in applied force at least either in an axial direction or a horizontal direction and displacement between the truer and the grinding stone measured with a load applied.
A grinding stone truing device for a grinding stone for use in a device for chamfering a wafer, the grinding stone truing device comprising:
- a truer moving stage that fixes a truer such that a rotational axis, an X axis, a Y axis, and a Z axis are made variable;
- a shape measurement unit that measures respective shapes of the truer and the grinding stone;
- a displacement evaluation unit that measures displacement of the truer and displacement of the grinding stone;
- a vibration measurement unit that measures vibration of the truer and vibration of the grinding stone;
- a machining heat evaluation unit that measures a temperature and a heat flow;
- a control unit that controls an incision amount, a rotational rate, and a position of the truer, based on respective measurement results from the displacement evaluation unit, the vibration measurement unit, and the machining heat evaluation unit;
- a machining condition database that stores the respective measurement results in association with the respective shapes of the truer and the grinding stone measured after truing;
- and
- a machining learning model constructed based on the machining condition database, wherein
- using the machining condition database and the machining learning model, the control unit controls the incision amount, the rotational rate, and the position of the truer to the grinding stone such that the grinding stone has a target shape.
Dependencies are inferred from the claim text.