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AssigneeShin-Etsu Handotai Co., Ltd.
InventorsKazutoshi Mizushima, Nakaji Miura, Yasuhiro Sekine, Makoto Suzuki, Kazuya Tomii
Estimating the term…
In a process for polishing the chamfered peripheral part of a wafer using a polishing cloth while supplying a polishing slurry in order to improve productivity of the process by reducing a polishing time, at least two steps of polishing processes are performed in sequence. The process comprises a first polishing process to polish a particular part, e.g. the part corresponding to the {110} plane of a peripheral part of the wafer and a second polishing process in which the whole part of a peripheral part of the wafer is polished for finishing by means of varying a hardness of the polishing clothes and/or a particle size of abrasives in the slurry such as the hardness of the polishing cloth in the second polishing process being softer than that of in the first polishing process and a particle size of abrasives in the slurry in the second polishing process being finer than that of in the first polishing process.
A method for polishing the chamfered peripheral part of a wafer with a polishing cloth while supplying a polishing slurry comprising the steps of performing a plurality of processes in sequence, wherein the plurality of processes includes at least two polishing processes performed on at least a first portion of the chamfered peripheral part of the wafer, and wherein the plurality of processes comprises a first polishing process to polish a first portion of the chamfered peripheral part of the wafer and a second polishing process in which the whole chamfered peripheral part of the wafer is polished for finishing.
A method for polishing the chamfered peripheral part of a wafer with a polishing cloth while supplying a polishing slurry comprising the steps of performing a plurality of processes in sequence, wherein the plurality of processes includes at least two polishing processes performed on at least a first portion of the chamfered peripheral part of the wafer, and wherein among the plurality of processes, a polishing rate is changed by changing at least one of a hardness of a polishing cloth and a particle size of the abrasives in the polishing slurry.
A method for polishing the chamfered peripheral part of a wafer with a polishing cloth while supplying a polishing slurry comprising the steps of performing a plurality of processes in sequence, wherein the plurality of processes includes at least two polishing processes performed on a least a first portion of the chamfered peripheral part of the wafer, and wherein the chamfered peripheral part of the wafer is pushed, while the wafer is rotated, against a rotating drum with a plurality of polishing cloths having different hardnesses affixed thereon and is rubbed with the cloths while supplying a slurry to the contact position of the cloths.
An apparatus for polishing the chamfered peripheral pert of a wafer having a rotating drum with a polishing cloth affixed thereon, a wafer rotating part which processes the chamfered peripheral part of the wafer against the rotating drum while rotating the wafer thereon, and a nozzle which supplies polishing slurry to the contact area of the polishing cloth on the chamfered peripheral part of the wafer comprising:
Dependencies are inferred from the claim text.