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US 12,623,313 B2Granted
Substrate processing apparatus and substrate processing method
AssigneeTokyo Electron Limited
InventorsYohei Yamawaki, Seiji Nakano, Yoshihiro Kawaguchi, Munehisa Kodama
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Abstract
A substrate processing apparatus includes a chuck configured to hold a substrate horizontally; a processing unit configured to press a processing tool against an outer periphery of the substrate held by the chuck to process the substrate; and a lower cup configured to collect a processing residue falling from the substrate over an entire circumference of the substrate. The lower cup is provided with a discharge opening through which the processing residue is discharged.
Claims18
A substrate processing apparatus, comprising:
- a chuck configured to hold a substrate horizontally;
- a processing unit configured to press a processing tool against an outer periphery of the substrate held by the chuck to process the substrate;
- and
- a lower cup configured to collect a processing residue falling from the substrate over an entire circumference of the substrate,
- wherein:
- the lower cup is provided with a discharge opening through which the processing residue is discharged,
- the lower cup comprises a lower cylindrical member which is larger than the substrate when viewed from above, and a lower lid which closes a lower end opening of the lower cylindrical member,
- the discharge opening is formed at the lower lid, and
- the lower cylindrical member comprises a groove to avoid interference between the lower cylindrical member and the processing unit.
6 more elements
A substrate processing apparatus, comprising:
- a chuck configured to hold a substrate horizontally:
- a processing unit configured to press a processing tool against an outer periphery of the substrate held by the chuck to process the substrate;
- and
- a lower cup configured to collect a processing residue falling from the substrate over an entire circumference of the substrate,
- wherein:
- the lower cup is provided with a discharge opening through which the processing residue is discharged, and
- the substrate processing apparatus further comprises:
- an upper cover configured to be moved up and down between a closing position where the upper cover closes at least a part of an upper end opening of the lower cup and an opening position where the upper cover opens the upper end opening of the lower cup,
- wherein the upper cover comprises an upper cylindrical member surrounding the outer periphery of the substrate held by the chuck, and
- wherein the upper cylindrical member comprises a groove to avoid interference between the upper cylindrical member and the processing unit.
7 more elements
A substrate processing apparatus, comprising:
- a chuck configured to hold a substrate horizontally:
- a processing unit configured to press a processing tool against an outer periphery of the substrate held by the chuck to process the substrate;
- and
- a lower cup configured to collect a processing residue falling from the substrate over an entire circumference of the substrate,
- wherein the lower cup is provided with a discharge opening through which the processing residue is discharged,
- wherein the substrate processing apparatus further comprises an upper cover configured to be moved up and down between a closing position where the upper cover closes at least a part of an upper end opening of the lower cup and an opening position where the upper cover opens the upper end opening of the lower cup,
- wherein the upper cover comprises a ceiling member which closes at least the outer periphery of the substrate held by the chuck from above, and
- wherein the ceiling member comprises a ring-shaped first horizontal member forming a first gap from the substrate held by the chuck, and a ring-shaped second horizontal member forming a second gap, from the substrate held by the chuck, the second gap being smaller than the first gap, the second horizontal member being located radially inside the first horizontal member.
5 more elements
A substrate processing apparatus, comprising:
- a chuck configured to hold a substrate horizontally;
- a processing unit configured to press a processing tool against an outer periphery of the substrate held by the chuck to process the substrate;
- and
- a lower cup configured to collect a processing residue falling from the substrate over an entire circumference of the substrate,
- wherein the lower cup is provided with a discharge opening through which the processing residue is discharged,
- wherein the processing unit comprises a processing tool mounting unit to which the processing tool is mounted, and a driving unit configured to move the processing tool mounting unit back and forth in a direction in which the processing tool mounting unit is connected to or disconnected from the chuck,
- wherein the processing unit comprises a first slider configured to be moved back and forth by the driving unit, a second slider configured to be moved back and forth along with the first slider, and an elastic body connecting the first slider and the second slider, and wherein the processing tool mounting unit is moved along with the second slider.
4 more elements
A substrate processing apparatus, comprising:
- a chuck configured to hold a substrate horizontally:
- a processing unit configured to press a processing tool against an outer periphery of the substrate held by the chuck to process the substrate;
- and
- a lower cup configured to collect a processing residue falling from the substrate over an entire circumference of the substrate,
- wherein the lower cup is provided with a discharge opening through which the processing residue is discharged, and
- wherein the substrate processing apparatus further comprises a pressing device configured to press the processing residue, which is pushed up from the substrate by the processing tool, from above while maintaining a distance from the processing tool in a circumferential direction of the substrate.
3 more elements
Dependencies are inferred from the claim text.