Device and method for truing grinding stone
AssigneeTokyo Seimitsu Co., Ltd.
InventorTaira TSURU
Life of this patent
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Abstract
Provided is a method for truing a grinding stone 16 for use in a device for chamfering a wafer W, the method comprising: truing the grinding stone 16 using a rough dressing truer 10-1 at high speed as rough machining to achieve a target rough dressing shape with a machining allowance left for truing; and truing, in a case where the grinding stone 16 fulfills an acceptable range of the target rough dressing shape, the grinding stone 16 using a fine dressing truer 10-2 larger in grit number than the rough dressing truer 10-1 as precision machining to achieve a target fine dressing shape. The method enables not only truing with high precision and high quality to a grinding stone having a complex grooved shape but also a reduction in the time required for truing to a difficult-to-machine material.
Claims11
1-10. (canceled)
A device for truing a grinding stone for use in a device for chamfering a wafer, the device comprising:
- a truer including a rough dressing truer and a fine dressing truer that are integrally formed in a two-tiered manner, the fine dressing truer being disposed coaxially to a rotational axis of the rough dressing truer, the fine dressing truer being finer than the rough dressing truer;
- a first sensor that detects a first position corresponding to at least one of the rough dressing truer and the fine dressing truer in a Z direction along the rotational axis;
- a second sensor that detects a second position of the grinding stone in the Z direction;
- and
- a control unit that adjusts respective positions in the Z direction of the truer and the grinding stone, based on the first position and the second position, measures respective shapes of the truer and the grinding stone after rough machining with the rough dressing truer, and determines whether to proceed to precision machining with the fine dressing truer.
A method for truing a grinding stone for use in a device for chamfering a wafer, the device including:
- a truer including a rough dressing truer and a fine dressing truer that are integrally formed in a two-tiered manner, the fine dressing truer being disposed coaxially to a rotational axis of the rough dressing truer, the fine dressing truer being finer than the rough dressing truer;
- a first sensor that detects a first position corresponding to at least one of the rough dressing truer and the fine dressing truer in a Z direction along the rotational axis;
- and a second sensor that detects a second position of the grinding stone in the Z direction, the method comprising:
- adjusting respective positions in the Z direction of the truer and the grinding stone, based on the first position and the second position, and performing, as rough machining, truing to the grinding stone using the rough dressing truer to achieve a target rough dressing shape;
- measuring respective shapes of the truer and the grinding stone, comparing the respective shapes to the target rough dressing shape, and determining whether to proceed to following precision machining;
- and
- adjusting, in a case where the grinding stone is determined as fulfilling an acceptable range of the target rough dressing shape, the respective positions in the Z direction of the truer and the grinding stone, based on the first position and the second position, and performing, as the precision machining, the truing using the fine dressing truer to achieve a target fine dressing shape.
Dependencies are inferred from the claim text.