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US 2026/0233358 A1Published application
Polishing device
AssigneeEbara Corporation
InventorsKenji KODERA, Kuo-Wei HONG, Hirotaka OHASHI, Hokuto YAMANOBE, Sho ISHIKAWA
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Abstract
The present invention relates to a polishing apparatus. The polishing apparatus includes a sensor structure (100) configured to detect a polishing amount of a peripheral portion of a substrate (W). The sensor structure (100) includes a sensor head (102) having a contact surface (102a), and a displacement sensor (101) configured to detect the polishing amount of the peripheral portion of the substrate (W) based on a displacement of the sensor head (102).
Claims8
A polishing apparatus comprising:
- a substrate stage configured to hold and rotate a substrate;
- a polishing head configured to press a polishing tool against a peripheral portion of the substrate;
- and
- a sensor structure configured to detect a polishing amount of the peripheral portion, and
- wherein the sensor structure comprises:
- a sensor head having a contact surface configured to contact the peripheral portion;
- and
- a displacement sensor configured to detect the polishing amount of the peripheral portion by a displacement of the sensor head.
5 more elements
Dependencies are inferred from the claim text.