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US 12,666,923 B2Granted
Chip treating method
AssigneeDisco Corporation
InventorMasaru Nakamura
Life of this patent
Estimating the term…
Abstract
A chip treating method includes a first tape affixing step of affixing a first tape to a circular wafer, a ring frame unit forming step of removing a central part of the wafer to form a ring frame unit having an opening, and a chip disposing step of disposing chips on the first tape exposed in the opening.
Claims9
A chip treating method of disposing a chip in an opening of a ring frame having the opening in a center of the ring frame, through a tape, the chip treating method comprising:
- a first tape affixing step of affixing a first tape to a wafer;
- after the first tape affixing step, a ring frame unit forming step of removing a central part of the wafer to form a ring frame unit having the opening and exposing the first tape in the opening;
- and
- a chip disposing step of disposing the chip on the first tape exposed in the opening of the ring frame unit.
1 more element
Dependencies are inferred from the claim text.