B24B 7/228
For grinding thin, brittle parts
Official title: {for grinding thin, brittle parts, e.g. semiconductors, wafers (grinding edges of thin, brittle parts B24B9/065)}
B24B7/228 (For grinding thin, brittle parts) appears on 606 US grants and 786 published applications in this corpus.
Search patents in B24B- Granted patents
- 606
- Published applications
- 786
- Assignees
- 261
- Inventors
- 1,483
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 3 | 0 |
| 1990 | 5 | 0 |
| 1991 | 4 | 0 |
| 1992 | 6 | 0 |
| 1993 | 4 | 0 |
| 1994 | 2 | 0 |
| 1995 | 3 | 0 |
| 1996 | 6 | 0 |
| 1997 | 11 | 0 |
| 1998 | 10 | 0 |
| 1999 | 10 | 0 |
| 2000 | 17 | 0 |
| 2001 | 15 | 10 |
| 2002 | 23 | 25 |
| 2003 | 15 | 23 |
| 2004 | 20 | 23 |
| 2005 | 20 | 15 |
| 2006 | 19 | 20 |
| 2007 | 12 | 25 |
| 2008 | 11 | 27 |
| 2009 | 14 | 32 |
| 2010 | 14 | 16 |
| 2011 | 18 | 18 |
| 2012 | 15 | 18 |
| 2013 | 16 | 22 |
| 2014 | 15 | 36 |
| 2015 | 28 | 23 |
| 2016 | 24 | 19 |
| 2017 | 19 | 22 |
| 2018 | 19 | 27 |
| 2019 | 21 | 39 |
| 2020 | 21 | 30 |
| 2021 | 20 | 41 |
| 2022 | 24 | 46 |
| 2023 | 26 | 50 |
| 2024 | 30 | 66 |
| 2025 | 35 | 73 |
| 2026 | 28 | 40 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Wafer grinding method6 Oct 2026US 12,752,389 B2Disco Corporation
- Polishing method for gallium nitride wafer6 Oct 2026US 12,757,663 B2Disco Corporation
- Chemical mechanical planarization polishing for shallow trench isolation29 Sep 2026US 12,751,256 B2Versum Materials US, LLC
- Multi-pattern in-pad surface for polish rate control22 Sep 2026US 12,741,357 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Apparatus for manufacturing analytical semiconductor samples and method for manufacturing analytical semiconductor samples by using the same15 Sep 2026US 12,736,446 B2Samsung Electronics Co., Ltd.
- Polishing device1 Oct 2026US 2026/0295765 A1Ebara Corporation
- Workpiece processing method and semiconductor device manufacturing method24 Sep 2026US 2026/0293562 A1Disco Corporation
- Processing apparatus and chip manufacturing method27 Aug 2026US 2026/0250874 A1Disco Corporation
- Polishing apparatus and method for polishing a workpiece20 Aug 2026US 2026/0241509 A1Disco Corporation
- Grinding apparatus30 Jul 2026US 2026/0216841 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Method of modifying an exposed surface of a semiconductor wafer335US 5,958,794 AMinnesota Mining and Manufacturing Company · 1999
- Method and apparatus for mechanical planarization and endpoint detection of a semiconductor wafer332US 5,081,796 AMicron Technology, Inc. · 1992
- Polishing pad with uniform abrasion215US 5,020,283 AMicron Technology, Inc. · 1991
- Polishing pad205US 5,177,908 AMicron Technology, Inc. · 1993
- Method for planarizing semiconductor wafers with a non-circular polishing pad197US 5,234,867 AMicron Technology, Inc. · 1993