Polishing apparatus and method for polishing a workpiece

A polishing apparatus, comprising:

• a chuck table configured to hold a workpiece on a holding surface and rotate along with the workpiece;
• and
• a polishing device configured to polish the workpiece, the polishing device including a first polishing mechanism and a second polishing mechanism,
• wherein the first polishing mechanism includes a first polishing pad including a circular polishing surface, a first rotation mechanism configured to rotate the first polishing pad about a center of the first polishing pad, and a first vertical movement mechanism configured to move the first polishing pad in a direction orthogonal to the holding surface,
• wherein the second polishing mechanism includes a second polishing pad including a circular polishing surface, a second rotation mechanism configured to rotate the second polishing pad about a center of the second polishing pad, and a second vertical movement mechanism configured to move the second polishing pad in the direction orthogonal to the holding surface,
• wherein the polishing apparatus further comprises:
• a first parallel movement mechanism configured to relatively move the first polishing pad in the first polishing mechanism and the chuck table in a direction parallel to the holding surface, and
• a controller configured to:
• control the first vertical movement mechanism to move the first polishing pad to contact the workpiece held on and rotating along with the chuck table, control the first parallel movement mechanism to relatively move the first polishing pad and the chuck table in a direction parallel to the holding surface within a range between a rotation center and an outer periphery of the workpiece, and control the first rotation mechanism to rotate the first polishing pad to polish the workpiece;
• and
• control the second vertical movement mechanism to move the second polishing pad to contact an outer peripheral region of the rotating workpiece and control the second rotation mechanism to rotate the second polishing pad to polish the workpiece.