Grinding apparatus
AssigneeSamsung Electronics Co., Ltd.
InventorTatsuya ISHIMOTO
Life of this patent
Estimating the term…
Abstract
A grinding apparatus includes a grinding unit configured to grind a molding resin layer of a workpiece, a measurement unit configured to measure a thickness of the molding resin layer, and a controller. The controller is configured to control the measurement unit to measure the thickness of the molding resin layer, obtain thickness information of the molding resin layer from the measurement unit, determine at least one grinding condition based on the thickness information of the molding resin layer, and control the grinding unit to perform a grinding process on the workpiece, the grinding process corresponding to the at least one grinding condition. The workpiece includes a substrate and the molding resin layer on the substrate, and the molding resin layer is colored or opaque.
Claims20
A grinding apparatus comprising:
- a grinding unit configured to grind a molding resin layer of a workpiece, the workpiece including a substrate and the molding resin layer on the substrate, and the molding resin layer being colored or opaque;
- a measurement unit configured to measure a thickness of the molding resin layer;
- and
- a controller configured to,
- control the measurement unit to measure the thickness of the molding resin layer;
- obtain thickness information of the molding resin layer from the measurement unit;
- determine at least one grinding condition based on the thickness information of the molding resin layer;
- and
- control the grinding unit to perform a grinding process on the workpiece, the grinding process corresponding to the at least one grinding condition.
A grinding apparatus comprising:
- a measurement unit on a first work and configured to measure a thickness of a molding resin layer of a workpiece;
- at least one grinding unit on a second work different from the first work and configured to grind the molding resin layer;
- a transfer unit configured to transfer the workpiece between the first work and the second work;
- and
- a controller configured to,
- control the measurement unit to measure a thickness of the molding resin layer;
- obtain thickness information of the molding resin layer from the measurement unit;
- determine grinding conditions based on the thickness information of the molding resin layer;
- control the transfer unit to transfer the workpiece to the at least one grinding unit;
- and
- control the at least one grinding unit to perform a grinding process on the molding resin layer, the grinding process corresponding to the grinding conditions.
A grinding apparatus comprising:
- a grinding unit configured to grind a molding resin layer of a workpiece, the workpiece including a substrate and the molding resin layer on the substrate, and the molding resin layer being colored or opaque;
- a measurement unit configured to measure a thickness of the molding resin layer, the measurement unit and the grinding unit being on a same work;
- and
- a controller configured to,
- control the measurement unit to measure the thickness of the molding resin layer;
- obtain thickness information of the molding resin layer from the measurement unit;
- determine grinding conditions based on the thickness information of the molding resin layer;
- and
- control the grinding unit to perform a grinding process on the workpiece, the grinding process corresponding to the grinding conditions.
Dependencies are inferred from the claim text.