Polishing device
AssigneeEbara Corporation
InventorsMANATO FURUSAWA, SATOSHI YAMANAKA, NOBUYUKI TAKADA, AKIHITO KOMINE
Life of this patent
Estimating the term…
Abstract
A polishing device is proposed. The polishing device includes: a polishing table, defining a polishing pad holding surface for holding a polishing pad; first and second polishing pad holding modules, configured such that the polishing pad slides along the polishing pad holding surface by the polishing pad supplied from the first polishing pad holding module being wound by the second polishing pad holding module; and a weight adjustment module, having a guide member extending in a direction in which the polishing pad slides along the polishing pad holding surface, and a weight member configured to be movable along the guide member.
Claims8
A polishing device, polishing a substrate using a polishing pad, the polishing device comprising:
- a polishing table, configured to be spinnable and defining a polishing pad holding surface for holding the polishing pad;
- first and second polishing pad holding modules, configured to be rotatable integrally with the polishing table and configured to hold the polishing pad wound in a roll shape, wherein the polishing pad supplied from the first polishing pad holding module is wound by the second polishing pad holding module, so that the polishing pad is configured to slide along the polishing pad holding surface;
- and
- a weight adjustment module, comprising:
- a guide member, extending in a direction in which the polishing pad slides along the polishing pad holding surface;
- and a weight member, configured to be movable along the guide member.
Dependencies are inferred from the claim text.