Wafer grinding method
AssigneeDisco Corporation
InventorsKenji Takenouchi, Mitsutane Kokubu, Masayoshi Teramoto, Koichi Kunimoto
Life of this patent
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Abstract
A wafer grinding method for grinding, by a grindstone, a reverse side of a wafer formed on a face side thereof with devices includes a protective member forming step of covering a whole area of the face side of the wafer with a protective member, a holding step of holding the wafer by a chuck table with the protective member therebetween, and a grinding step of grinding the reverse side of the wafer by the grindstone while supplying grinding water containing a surfactant to the grindstone and the wafer.
Claims13
A wafer grinding method for grinding, by a grindstone, a reverse side of a wafer formed on a face side thereof with a plurality of devices, the wafer grinding method comprising:
- a protective member forming step of covering a whole area of the face side of the wafer with a protective member;
- a holding step of holding the wafer by a chuck table with the protective member therebetween;
- and
- a grinding step of grinding the reverse side of the wafer by the grindstone while supplying grinding water containing a surfactant to the grindstone and the wafer, wherein a concentration of the surfactant contained in the grinding water is set based on a type of grinding performed in the grinding step.
Dependencies are inferred from the claim text.