B24B 53/00
Devices or means for dressing or conditioning abrasive surfaces
Official title: Devices or means for dressing or conditioning abrasive surfaces (compensation for grinding wheel abrasion resulting from dressing B24B47/25)
B24B53/00 (Devices or means for dressing or conditioning abrasive surfaces) appears on 1,833 US grants and 1,600 published applications in this corpus.
Search patents in B24B- Granted patents
- 1,833
- Published applications
- 1,600
- Assignees
- 620
- Inventors
- 3,295
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 15 | 0 |
| 1978 | 16 | 0 |
| 1979 | 9 | 0 |
| 1980 | 13 | 0 |
| 1981 | 15 | 0 |
| 1982 | 3 | 0 |
| 1983 | 6 | 0 |
| 1984 | 18 | 0 |
| 1985 | 23 | 0 |
| 1986 | 7 | 0 |
| 1987 | 12 | 0 |
| 1988 | 9 | 0 |
| 1989 | 16 | 0 |
| 1990 | 17 | 0 |
| 1991 | 24 | 0 |
| 1992 | 20 | 0 |
| 1993 | 13 | 0 |
| 1994 | 11 | 0 |
| 1995 | 9 | 0 |
| 1996 | 20 | 0 |
| 1997 | 48 | 0 |
| 1998 | 36 | 0 |
| 1999 | 62 | 0 |
| 2000 | 82 | 0 |
| 2001 | 103 | 43 |
| 2002 | 102 | 85 |
| 2003 | 90 | 73 |
| 2004 | 80 | 88 |
| 2005 | 84 | 74 |
| 2006 | 90 | 76 |
| 2007 | 57 | 71 |
| 2008 | 30 | 50 |
| 2009 | 28 | 52 |
| 2010 | 33 | 49 |
| 2011 | 16 | 34 |
| 2012 | 23 | 53 |
| 2013 | 44 | 36 |
| 2014 | 41 | 69 |
| 2015 | 42 | 66 |
| 2016 | 50 | 62 |
| 2017 | 43 | 51 |
| 2018 | 33 | 70 |
| 2019 | 50 | 61 |
| 2020 | 53 | 75 |
| 2021 | 22 | 51 |
| 2022 | 29 | 55 |
| 2023 | 59 | 67 |
| 2024 | 39 | 60 |
| 2025 | 52 | 90 |
| 2026 | 32 | 39 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- B24B 53/017Devices or means for dressing, cleaning or otherwise conditioning lapping tools1,188
- B24B 53/12Dressing tools352
- B24B 53/06Devices or means for dressing or conditioning abrasive surfaces: of profiled abrasive282
- B24B 53/04Devices or means for dressing or conditioning abrasive surfaces: of cylindrical or115
- B24B 53/02Devices or means for dressing or conditioning abrasive surfaces: of plane surfaces78
- B24B 53/001Involving the use of electric current74
- B24B 53/007Cleaning of grinding wheels64
- B24B 53/013Application of loose grinding agent as auxiliary tool during truing operation46
All 12 subgroupsShow fewer
- B24B 53/003Devices or means for dressing or conditioning abrasive surfaces: using at least32
- B24B 53/005Positioning devices for conditioning tools30
- B24B 53/10Devices or means for dressing or conditioning abrasive surfaces: of travelling flexible22
- B24B 53/095Cooling or lubricating during dressing operation21
Recent patents
- Conditioner and chemical mechanical polishing apparatus including the same6 Oct 2026US 12,752,393 B2Samsung Electronics Co., Ltd.
- Polishing pad conditioning apparatus29 Sep 2026US 12,746,639 B2Hangzhou Sizone Electronic Technology Inc.
- Method for refreshing polishing pad and method for manufacturing semiconductor device using the same15 Sep 2026US 12,734,640 B2Enpulse Co., Ltd.
- Method and apparatus to clean substrate with atomizing nozzle8 Sep 2026US 12,728,445 B2APPLIED Materials.Inc.
- Substrate suction member, elastic seal assembly, top ring, and substrate processing apparatus8 Sep 2026US 12,728,497 B2Ebara Corporation
- Chemical mechanical polishing temperature scanning apparatus for temperature control8 Oct 2026US 2026/0307202 A1APPLIED Materials.Inc.
- Polishing system having selectable pad conditioner height and related methods8 Oct 2026US 2026/0307204 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Polishing pad conditioner manufacturing method8 Oct 2026US 2026/0307206 A1Nippon Alloy co., Ltd.
- Slurry recycling for chemical mechanical planarazation system8 Oct 2026US 2026/0307209 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Method for the continuous generating grinding of gears, and profiling method24 Sep 2026US 2026/0284762 A1Gleason Switzerland AG
Most cited
By later US patents
- Continuous processing system for chemical mechanical polishing501US 5,738,574 AAPPLIED Materials.Inc. · 1998
- Method of modifying an exposed surface of a semiconductor wafer335US 5,958,794 AMinnesota Mining and Manufacturing Company · 1999
- Polishing pad conditioning apparatus for wafer planarization process292US 5,216,843 AIntel Corporation · 1993
- Superhard cutting element having reduced surface roughness and method of modifying288US 5,447,208 ABaker Hughes Incorporated · 1995
- Modified superhard cutting elements having reduced surface roughness method of modifying, drill bits equipped with such cutting elements, and methods of drilling therewith253US 5,653,300 ABaker Hughes Incorporated · 1997