B24B 53/013
Application of loose grinding agent as auxiliary tool during truing operation
B24B53/013 (Application of loose grinding agent as auxiliary tool during truing operation) appears on 46 US grants and 29 published applications in this corpus.
Search patents in B24B- Granted patents
- 46
- Published applications
- 29
- Assignees
- 37
- Inventors
- 99
- Latest grant
- 15 Aug 2023
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1993 | 2 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 6 | 0 |
| 2001 | 6 | 3 |
| 2002 | 1 | 4 |
| 2003 | 4 | 4 |
| 2004 | 3 | 3 |
| 2005 | 3 | 1 |
| 2006 | 4 | 3 |
| 2007 | 2 | 3 |
| 2008 | 1 | 0 |
| 2009 | 5 | 1 |
| 2010 | 0 | 1 |
| 2011 | 2 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 2 |
| 2019 | 1 | 1 |
| 2020 | 1 | 1 |
| 2021 | 1 | 1 |
| 2022 | 1 | 0 |
| 2023 | 1 | 0 |
| 2024 | 0 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Chemical mechanical polishing system and method of using15 Aug 2023US 11,724,360 B2Taiwan Semiconductor Manufacturing Company.Ltd
- CMP polishing pad conditioner4 Jan 2022US 11,213,927 B2Entregis, Inc.
- Rotating applicators having fluid dispensers5 Oct 2021US 11,135,612 B2The Boeing Company
- Dressing method and dressing apparatus10 Nov 2020US 10,828,746 B2Bando Kiko Co., Ltd.
- Chemical mechanical polishing device and chemical mechanical polishing method22 Oct 2019US 10,453,702 B2SEMICONDUCTOR MANF. INTL. (BEIJING) Corp.
- Polishing pad conditioning system and method of using11 Jan 2024US 2024/0009801 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Chemical mechanical polishing system and method of using2 Dec 2021US 2021/0370466 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Rotating applicators24 Sep 2020US 2020/0298268 A1The Boeing Company
- Cmp polishing pad conditioner4 Jul 2019US 2019/0202028 A1Sinmat, Inc.
- Dressing method and dressing apparatus2 Aug 2018US 2018/0215009 A1Bando Kiko Co., Ltd.
Most cited
By later US patents
- Method and apparatus for controlling a temperature of a polishing pad used in planarizing substrates84US 5,957,750 AMicron Technology, Inc. · 1999
- Polishing method for semiconductors and apparatus therefor45US 6,099,393 AHitachi, Ltd. · 2000
- CMP pad conditioner arrangement and method therefor24US 6,331,136 B1Koninklijke Philips Electronics N.V. (KPENV) · 2001
- In-situ/self-propelled polishing pad conditioner and cleaner23US 6,179,693 B2International Business Machines Corporation · 2001
- Polishing apparatus23US 6,953,390 B2Ebara Corporation · 2005