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US 6,099,393 AGranted
Polishing method for semiconductors and apparatus therefor
AssigneeHitachi, Ltd.
InventorsSoichi Katagiri, Shigeo Moriyama, Kan Yasui, Katsuhiko Yamaguchi
Life of this patent
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AssigneeHitachi, Ltd.
InventorsSoichi Katagiri, Shigeo Moriyama, Kan Yasui, Katsuhiko Yamaguchi
Estimating the term…
In the polishing machine 10 for pressing the polished surface 7 of the workpiece 1 against the face where there are abrasives 15 of the rotating polishing tool 11 and executing chemical mechanical polishing, the brushing device 30, the cleaner 40, the abrasive supplier 52, and the pure water supplier 60 are sequentially arranged behind the location of the head 20 for pressing the workpiece 1 against the polishing tool 11 in the rotational direction. The cleaner 40 sprays the cleaning water 47 to the face where there are abrasives 15 of the rotating polishing tool 11 and sucks and collects it by the vacuum hole 45. Fresh slurry 62 is always supplied by the slurry supplier 63 comprising the abrasive supplier 52 and the pure water supplier 60.
A polishing method comprising the step of:
A polishing machine for pressing and polishing a surface of a workpiece to be polished against a face of a polishing tool, said face containing abrasives thereon, comprising:
A polishing machine for pressing and polishing a surface of a workpiece to be polished against a face of a polishing tool, said face containing abrasives thereon, comprising:
Dependencies are inferred from the claim text.