Cmp polishing pad conditioner

A chemical mechanical polishing (CMP) pad conditioner, comprising:

• a conditioner substrate comprising a metal, ceramic or a metal-ceramic material;
• said conditioner substrate having a patterned surface coated with a polycrystalline diamond film including a plurality of diamond particles;
• wherein said polycrystalline diamond film has at least 80 percent of its tallest grains having an orientation within 20 degrees from a (111) orientation.

A method of processing a chemical mechanical polishing (CMP) pad conditioner, comprising:

• providing said CMP pad conditioner comprising a conditioner substrate including a metal, ceramic or a metal-ceramic material having a patterned surface with a polycrystalline diamond film thereon, and a slurry including an aqueous medium and a plurality of hard slurry particles having a hardness greater than 3,000 Kg/mm2, and
• polishing said polycrystalline diamond film in a CMP apparatus using a polishing pad,
• wherein said polycrystalline diamond film after said polishing has at least 80 percent of its tallest grains having an orientation within 20 degrees from a (111) orientation.