Method and apparatus to clean substrate with atomizing nozzle

A chemical mechanical polishing system, comprising:

• a first polishing station including a first platen to support a first polishing pad;
• a transfer station to receive a substrate from a robot, the transfer station including a substrate support;
• a carrier head movable on a predetermined path from the first polishing station to the transfer station;
• a gas flow regulator having an input for a carrier gas;
• a liquid flow regulator having an input for a cleaning liquid;
• a fluid jet cleaner positioned within the transfer station, the fluid jet cleaner including an atomizer nozzle including an input port coupled to the gas flow regulator, an injection port coupled to the liquid flow regulator, and an output port positioned to spray the cleaning liquid entrained in the carrier gas onto the substrate held by the carrier head when the carrier head is located above the fluid jet cleaner, the atomizer nozzle is supported by and movable with the substrate support;
• a nebulizer in the transfer station to spray a rinsing fluid on the substrate;
• and
• a controller configured to control the gas flow regulator and liquid flow regulator such that a first pressure of the spray of cleaning liquid on the substrate is greater than a second pressure of the spray of rinsing liquid on the substrate.

A chemical mechanical polishing system, comprising:

• a first polishing station including a first platen to support a first polishing pad;
• a transfer station to receive a substrate from a robot;
• a carrier head movable on a predetermined path from the first polishing station to the transfer station;
• a gas flow regulator having an input for a carrier gas;
• a liquid flow regulator having an input for a cleaning liquid;
• a fluid jet cleaner at a position along the predetermined path, the fluid jet cleaner including a plurality of atomizer nozzles arranged in a line with each atomizer nozzle including an input port coupled to the gas flow regulator, an injection port coupled to the liquid flow regulator, and an output port positioned to spray the cleaning liquid entrained in the carrier gas onto the substrate held by the carrier head when the carrier head is located above the fluid jet cleaner,
• a controller configured to cause the carrier head to rotate at a rotation rate to sweep the line of atomizer nozzles in an orbit around a center of the substrate while the atomizer nozzles spray the cleaning liquid on the substrate, wherein the gas flow regulator and liquid flow regulator such that the spray of cleaning liquid on the substrate from each nozzle covers a width, and wherein a pitch between the plurality of atomizer nozzles is greater than the width, and wherein the controller is configured to cause the carrier head to oscillate laterally at an oscillation frequency that is lower than the rotation rate of the carrier head.