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US 12,752,393 B2Granted
Conditioner and chemical mechanical polishing apparatus including the same
AssigneeSamsung Electronics Co., Ltd.
InventorsYeonsu Go, Donghoon Kwon
Life of this patent
Estimating the term…
Abstract
Provided is a conditioner including a conditioning arm on a polishing pad that is configured to chemically mechanically polish a substrate based on slurry, a conditioning disk on the conditioning arm that is configured to condition the polishing pad, a dilution solution injector on a first side of the conditioning arm and configured to inject a dilution solution to the slurry introduced into a space under the conditioning disk, and a sonicator on a second side of the conditioning arm and configured to apply an ultrasonic wave to debris generated from the polishing pad.
Claims20
A conditioner comprising:
- a conditioning arm on a polishing pad that is configured to chemically mechanically polish a substrate based on slurry;
- a conditioning disk on the conditioning arm that is configured to condition the polishing pad;
- a dilution solution injector on a first side of the conditioning arm and configured to inject a dilution solution to the slurry introduced into a space under the conditioning disk;
- and
- a sonicator on a second side of the conditioning arm and configured to apply an ultrasonic wave to debris generated from the polishing pad,
- wherein the dilution solution injector and the sonicator are provided on a same plane parallel to an upper surface of the polishing pad and spaced apart and separated from each other in a direction parallel to the upper surface of the polishing pad, and
- wherein the dilution solution injector is provided on the first side of the conditioning arm and the sonicator is provided on the second side of the conditioning arm opposite to the first side with respect to a rotation direction of the polishing pad.
4 more elements
A conditioner comprising:
- a conditioning arm on a polishing pad that is configured to chemically mechanically polish a substrate based on slurry;
- a conditioning disk on the conditioning arm that is configured to condition the polishing pad;
- a dilution solution injector having a semi-ring shape and adjacent to a front portion of the conditioning arm oriented in a direction opposite to a rotation direction of the polishing pad, the dilution solution injector being configured to inject a dilution solution to the slurry introduced into a space under the conditioning disk;
- a sonicator having a semi-ring shape and adjacent to a rear portion of the conditioning arm opposite to the front portion, the sonicator being configured to apply an ultrasonic wave to debris generated from the polishing pad;
- and
- a cleaner configured to clean the sonicator,
- wherein the dilution solution injector and the sonicator are provided on a same plane parallel to an upper surface of the polishing pad and spaced apart and separated from each other in the direction parallel to the upper surface of the polishing pad.
4 more elements
A chemical mechanical polishing (CMP) apparatus comprising:
- a polishing head configured to hold a substrate;
- a platen under the polishing head;
- a polishing pad on the platen and configured to chemically mechanically polish the substrate;
- a slurry arm configured to supply slurry to the polishing pad;
- a conditioner configured to condition the polishing pad;
- a dilution solution injector on a first side of the conditioner, the dilution solution injector being configured to inject a dilution solution to the slurry introduced into a space under the conditioner;
- and
- a sonicator on a second side of the conditioner, the sonicator being configured to apply an ultrasonic wave to debris generated from the polishing pad,
- wherein the dilution solution injector and the sonicator are provided on a same plane parallel to an upper surface of the polishing pad and spaced apart and separated from each other in a direction parallel to the upper surface of the polishing pad, and
- wherein the dilution solution injector is provided on the first side of the conditioner and the sonicator is provided on the second side of the conditioner opposite to the first side with respect to a rotation direction of the polishing pad.
7 more elements
Dependencies are inferred from the claim text.