Polishing pad conditioning apparatus

A polishing pad conditioning apparatus, comprising:

• a connecting arm extending horizontally;
• a finishing head unit arranged at one end of the connecting arm and used for finishing a polishing pad;
• and
• a base unit arranged at the other end of the connecting arm, movably connected to the connecting arm and used for driving the connecting arm to drive the finishing head unit to vertically move up and down, so that the finishing head unit is close to or far away from the polishing pad in a direction tending to be perpendicular to the polishing pad,
• wherein the base unit at least comprising:
• a mounting base:
• a connector capable of vertically moving up and down with respect to the mounting base and connected to the connecting arm;
• a movable connecting plate connected to the connecting arm and driven by the connecting arm to vertically move up and down along the mounting base;
• and
• an adjusting assembly, wherein the adjusting assembly penetrates through the connecting arm to abut against a top surface of the movable connecting plate to adjust a clearance between the connecting arm and the movable connecting plate so as keep the connecting plate horizontal.