B24B 53/003
Devices or means for dressing or conditioning abrasive surfaces: using at least
Official title: {using at least two conditioning tools}
B24B53/003 (Devices or means for dressing or conditioning abrasive surfaces: using at least) appears on 32 US grants and 36 published applications in this corpus.
Search patents in B24B- Granted patents
- 32
- Published applications
- 36
- Assignees
- 29
- Inventors
- 96
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 0 |
| 2002 | 1 | 1 |
| 2003 | 0 | 0 |
| 2004 | 1 | 0 |
| 2005 | 1 | 3 |
| 2006 | 2 | 1 |
| 2007 | 1 | 1 |
| 2008 | 2 | 0 |
| 2009 | 0 | 2 |
| 2010 | 0 | 1 |
| 2011 | 0 | 1 |
| 2012 | 0 | 1 |
| 2013 | 2 | 1 |
| 2014 | 0 | 1 |
| 2015 | 2 | 0 |
| 2016 | 1 | 3 |
| 2017 | 0 | 1 |
| 2018 | 1 | 1 |
| 2019 | 1 | 1 |
| 2020 | 1 | 3 |
| 2021 | 1 | 1 |
| 2022 | 0 | 3 |
| 2023 | 4 | 4 |
| 2024 | 0 | 2 |
| 2025 | 2 | 2 |
| 2026 | 2 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Robotic polishing system and method for using same18 Aug 2026US 12,708,976 B2Pratt & Whitney Canada Corp.
- Condensed gas pad conditioner21 Apr 2026US 12,605,802 B2APPLIED Materials.Inc.
- Liquid feeder and polishing apparatus15 Jul 2025US 12,358,098 B2Ebara Corporation
- Multiple disk pad conditioner24 Jun 2025US 12,337,439 B2APPLIED Materials.Inc.
- Dressing board, use method of dressing board, and cutting apparatus26 Dec 2023US 11,850,696 B2Disco Corporation
- Device and method for truing grinding stone13 Aug 2026US 2026/0233359 A1Tokyo Seimitsu Co., Ltd.
- Method for producing a structure on a surface30 Apr 2026US 2026/0115757 A1Hymmen GmbH Maschinen- und Anlagenbau
- Method For Pre-Profiling A Grinding Tool31 Jul 2025US 2025/0242471 A1Reishauer AG
- Methods for conditioning polishing pads20 Mar 2025US 2025/0091177 A1GlobalWafers Co., Ltd.
- Robotic polishing system and method for using same27 Jun 2024US 2024/0208073 A1Pratt & Whitney Canada Corp.
Most cited
By later US patents
- Method and apparatus for improved conditioning of polishing pads37US 5,941,762 A1999
- Method and apparatus for improved conditioning of polishing pads35US 6,123,607 A2000
- Polishing apparatus35US 6,939,208 B2Ebara Corporation · 2005
- Method and apparatus for automated quality control in wafer slicing29US 5,632,666 AMEMC Electronic Materials, Inc. · 1997
- Polishing apparatus27US 7,040,968 B2Ebara Corporation · 2006