Method and apparatus for automated quality control in wafer slicing
AssigneeMEMC Electronic Materials, Inc.
InventorsAndrea Peratello, Fabrizio Leoni
Life of this patent
Estimating the term…
Abstract
An internal diameter saw, and in particular a method for operation which facilitates the maintenance of quality control of semiconductor wafers sliced from an ingot of source material. The internal diameter saw has a controller which monitors the deflection of the cutting edge of the blade at a location within the ingot as a wafer is sliced. Depending upon the deflection of the blade which is detected within the crystal, a blade dressing device is automatically activated to sharpen the blade following the cut.
Claims18
A method for slicing wafers from an ingot of wafer source material using an internal diameter saw having an annular blade in which at least one process parameter having a direct relationship to wafer quality is measured and automatic adjustments are made in response to the measured process parameter, the method comprising the steps of:
- slicing a wafer from the ingot with the internal diameter saw;
- detecting during the step of slicing at at least one location a blade location factor including at least one of the position of the blade within the ingot in directions generally perpendicular to the plane of the blade and the force applied to the blade for urging the blade to maintain a zero blade deflection position;
- generating at least one signal corresponding to the detected blade location factor;
- transmitting the detected blade location factor signal to a control circuit;
- determining in the control circuit the deviation of the detected blade location factor from a zero blade deviation factor stored in the control circuit;
- comparing in the control circuit the determined blade deviation to a maximum blade deviation limit stored in the control circuit;
- and
- activating by operation of the control circuit a blade dressing device to sharpen the blade if the determined deviation of the blade location factor exceeds the stored maximum blade deviation limit;
- counting within the control circuit the number of wafers sliced during which the determined blade deflection exceeded the maximum blade deflection limit since the last blade dressing;
- and
- prohibiting activation of the blade dressing device in the control circuit if the counted number of wafers sliced since the last blade dressing is fewer than a predetermined lower limit stored in the control circuit.
A method for slicing wafers from an ingot of wafer source material using an internal diameter saw having an annular blade in which process parameters having a direct relationship to wafer quality are measured and automatic adjustments are made in response to measured process parameters, the method comprising the steps of:
- slicing a wafer from the ingot with the internal diameter saw;
- applying a force to one of an inner face and an outer face of the blade to urge the blade toward a zero blade deflection position;
- detecting the position of the blade at least one location during the step of slicing;
- detecting the force applied to said one face of the blade at least one location during the step of slicing;
- generating signals corresponding to the detected blade position and detected force;
- transmitting the detected blade position and detected force signals to a control circuit;
- determining in the control circuit the deflection of the detected blade position from the zero deflection blade position stored in the control circuit;
- comparing in the control circuit the determined blade deflection to a maximum blade deflection limit stored in the control circuit;
- determining in the control circuit the deviation of the detected force applied to the blade from a zero blade deflection force selected to maintain the blade in the zero blade deflection position;
- comparing in the control circuit the force deviation to a maximum force deviation limit stored in the control circuit;
- and
- activating by operation of the control circuit a blade dressing device to sharpen the blade if the determined blade deflection exceeds the stored maximum blade deflection limit or if the determined force deviation exceeds the maximum force deviation limit;
- counting within the control circuit the number of wafers sliced during which the determined blade deflection or determined force deviation exceeded the maximum blade deflection limit or maximum force deviation limit since the last blade dressing;
- and
- prohibiting activation of the blade dressing device in the control circuit if the counted number of wafers sliced since the last blade dressing is fewer than a predetermined lower limit stored in the control circuit.
Apparatus for slicing wafers from an ingot of wafer source material comprising:
- an internal diameter saw including an annular blade having an inner face, an outer face and a cutting edge on its internal diameter, a frame mounting the annular blade for rotation relative thereto and capable of supporting the ingot for slicing;
- sensor means located for detecting a blade location factor as the saw is slicing a wafer from the ingot, the blade location factor being selected from at least one of the position of the blade within the ingot and the force applied to the blade for urging the blade to maintain a zero blade deflection position, and transmitting a signal corresponding to the detected blade location factor;
- an automatic dressing device mounted for sharpening the cutting edge of the annular blade;
- a controller for controlling the automatic dressing machine, the controller being programmed for receiving the signal from the sensor corresponding to the detected blade location factor, determining the deviation of the blade location factor from a zero blade deviation factor stored in the controller, comparing the determined blade deviation to a maximum blade deviation limit stored in the controller, and activating the blade dressing device to sharpen the blade if the determined blade deviation exceeds the stored maximum blade deviation limit;
- the controller including means for counting the number of wafers sliced during which the determined blade deflection or determined force deviation exceeded the maximum blade deflection limit or maximum force deviation limit since the last blade dressing, and means for prohibiting activation of the blade dressing device if the counted number of wafers sliced since the last blade dressing is fewer than a predetermined lower limit stored in the controller.
Dependencies are inferred from the claim text.