Methods for conditioning polishing pads
AssigneeGlobalWafers Co., Ltd.
InventorsJing Ru Hong, JenHo Hsu, Shih Chiang Chen, ChinYu Chang
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Abstract
Methods for breaking-in new polishing pads of a double-side polishing apparatus for polishing substrates such as single crystal silicon wafers are disclosed. The methods may involve contacting the new polishing pads with a conditioning substrate such as a substate that includes diamonds at the surface of the substrate. Conditioning methods may also involve contacting the new polishing pad with sacrificial substrates.
Claims20
A method for conditioning new polishing pads in a double-side polishing apparatus having first and second platens and wafer carriers, the method comprising:
- mounting the new polishing pads on the first and second platens;
- placing sacrificial wafers in the wafer carriers;
- contacting the sacrificial wafers with the new polishing pads while supplying a first polishing fluid to the new polishing pads in a first polishing operation;
- contacting the new polishing pads with a conditioning substrate;
- and
- contacting sacrificial wafers with the new polishing pads while supplying a second polishing fluid to the new polishing pads in a second polishing operation.
A method for conditioning a new polishing pad in a double-side polishing apparatus having first and second platens and one or more wafer carriers, the method comprising:
- mounting the new polishing pad on the first platen or the second platen;
- placing one or more sacrificial wafers in the one or more wafer carriers;
- contacting a first batch of one or more sacrificial wafers with the new polishing pad while supplying a first polishing fluid to the new polishing pad in a first polishing operation;
- contacting the new polishing pad with a conditioning substrate;
- and
- contacting a second batch of one or more sacrificial wafers with the new polishing pad while supplying a second polishing fluid to the new polishing pad in a second polishing operation.
A method for polishing product substates in a double-side polishing apparatus having first and second platens and wafer carriers, the method comprising:
- mounting new polishing pads on the first and second platens;
- placing sacrificial wafers in the wafer carriers;
- contacting the sacrificial wafers with the new polishing pads while supplying a first polishing fluid to the new polishing pads in a first polishing operation;
- contacting the new polishing pads with a conditioning substrate;
- contacting sacrificial wafers with the new polishing pads while supplying a second polishing fluid to the new polishing pads in a second polishing operation;
- placing product wafers in the wafer carriers;
- and
- contacting the product wafers with the new polishing pads while supplying a third polishing fluid to the new polishing pads in a third polishing operation.
Dependencies are inferred from the claim text.