B24B 53/001
Involving the use of electric current
Official title: {involving the use of electric current}
B24B53/001 (Involving the use of electric current) appears on 74 US grants and 45 published applications in this corpus.
Search patents in B24B- Granted patents
- 74
- Published applications
- 45
- Assignees
- 54
- Inventors
- 187
- Latest grant
- 3 Sep 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1989 | 2 | 0 |
| 1990 | 0 | 0 |
| 1991 | 5 | 0 |
| 1992 | 1 | 0 |
| 1993 | 3 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 4 | 0 |
| 1998 | 1 | 0 |
| 1999 | 3 | 0 |
| 2000 | 7 | 0 |
| 2001 | 6 | 6 |
| 2002 | 5 | 1 |
| 2003 | 7 | 4 |
| 2004 | 4 | 2 |
| 2005 | 3 | 3 |
| 2006 | 2 | 3 |
| 2007 | 0 | 2 |
| 2008 | 0 | 2 |
| 2009 | 1 | 2 |
| 2010 | 1 | 1 |
| 2011 | 1 | 0 |
| 2012 | 1 | 3 |
| 2013 | 3 | 2 |
| 2014 | 2 | 2 |
| 2015 | 0 | 2 |
| 2016 | 2 | 2 |
| 2017 | 1 | 0 |
| 2018 | 1 | 0 |
| 2019 | 1 | 1 |
| 2020 | 1 | 1 |
| 2021 | 0 | 2 |
| 2022 | 1 | 2 |
| 2023 | 1 | 2 |
| 2024 | 2 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Chemical mechanical polishing apparatus and method3 Sep 2024US 12,076,831 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Electrochemical discharge-assisted micro-grinding device for micro-components of brittle and hard materials28 May 2024US 11,992,890 B2Changsha University of Science and Technology
- Chemical mechanical polishing method13 Jun 2023US 11,673,223 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Chemical mechanical polishing apparatus and method5 Apr 2022US 11,292,101 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Single-point diamond dresser for grinding wheel based on acoustic emission online monitoring17 Nov 2020US 10,836,011 B2Changsha University of Science and Technology
- Electrochemical Discharge-assisted Micro-grinding Device for Micro-components of Brittle and Hard Materials12 Oct 2023US 2023/0321740 A1Changsha University of Science and Technology
- Chemical mechanical polishing apparatus and method24 Aug 2023US 2023/0264317 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Chemical mechanical polishing method14 Jul 2022US 2022/0219285 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Polishing pad conditioner and manufacturing method thereof14 Apr 2022US 2022/0111488 A1Kinik Company
- Online precise control method for truncating parameters of microscale abrasive grains9 Sep 2021US 2021/0278817 A1South China University of Technology
Most cited
By later US patents
- Apparatus and methods for conditioning polishing pads in mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies108US 6,203,413 B1Micron Technology, Inc. · 2001
- Chemical-mechanical polish (CMP) pad conditioner104US 5,823,854 AIndustrial Technology Research Institute · 1998
- Method of grinding an axially asymmetric aspherical mirror97US 6,537,138 B2Riken · 2003
- Chemical-mechanical polish (CMP) pad conditioner51US 5,985,093 AIndustrial Technology Research Institute · 1999
- Apparatus and methods for conditioning polishing pads in mechanical and/or chemical-mechanical planarization of microelectronic device substrate assemblies31US 6,361,413 B1Micron Technology, Inc. · 2002