B24B 53/005
Positioning devices for conditioning tools
Official title: {Positioning devices for conditioning tools}
B24B53/005 (Positioning devices for conditioning tools) appears on 30 US grants and 45 published applications in this corpus.
Search patents in B24B- Granted patents
- 30
- Published applications
- 45
- Assignees
- 27
- Inventors
- 124
- Latest grant
- 19 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 2 | 0 |
| 2002 | 1 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 1 |
| 2008 | 0 | 2 |
| 2009 | 0 | 3 |
| 2010 | 1 | 1 |
| 2011 | 1 | 1 |
| 2012 | 0 | 2 |
| 2013 | 0 | 0 |
| 2014 | 1 | 4 |
| 2015 | 2 | 3 |
| 2016 | 4 | 2 |
| 2017 | 0 | 0 |
| 2018 | 4 | 3 |
| 2019 | 0 | 2 |
| 2020 | 2 | 3 |
| 2021 | 0 | 2 |
| 2022 | 1 | 2 |
| 2023 | 4 | 4 |
| 2024 | 0 | 1 |
| 2025 | 3 | 5 |
| 2026 | 2 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Use of steam for pre-heating of CMP components19 May 2026US 12,629,796 B2APPLIED Materials.Inc.
- Grinding apparatus and method for manufacturing semiconductor device using the same3 Mar 2026US 12,564,914 B2Samsung Electronics Co., Ltd.
- In-situ conditioner disk cleaning during CMP4 Nov 2025US 12,459,078 B2APPLIED Materials.Inc.
- Gin blade sharpening system and method of use30 Sep 2025US 12,427,593 B2
- Methods and apparatus for performing multiple manufacturing operations on an object17 Jun 2025US 12,330,256 B2Coventry Associates, Inc.
- Device and method for truing grinding stone13 Aug 2026US 2026/0233359 A1Tokyo Seimitsu Co., Ltd.
- Substrate polishing device, substrate processing device, method, and storage medium2 Jul 2026US 2026/0183899 A1Ebara Corporation
- Grinding apparatus and method for manufacturing semiconductor device using the same18 Jun 2026US 2026/0166674 A1Samsung Electronics Co., Ltd.
- Finishing tool12 Feb 2026US 2026/0042153 A1Sugino Machine Limited
- In-situ conditioner disk cleaning during cmp23 Oct 2025US 2025/0326086 A1APPLIED Materials.Inc.
Most cited
By later US patents
- Grinding machine30US 6,224,462 B1Hitachi Seiki Co., Ltd. · 2001
- Pad conditioner cleaning apparatus21US 6,358,124 B1APPLIED Materials.Inc. · 2002
- Precision grinding machine18US 5,323,572 AVoumard Machines Co. S.A. · 1994
- Method and apparatus for monitoring a polishing surface of a polishing pad used in polishing apparatus12US 9,156,122 B2Ebara Corporation · 2015
- Pad conditioner cleaning apparatus11US 6,217,430 B1APPLIED Materials.Inc. · 2001