In-situ conditioner disk cleaning during CMP

A method of chemical mechanical polishing, comprising:

• bringing a substrate into contact with a polishing pad;
• during polishing of the substrate, sweeping a conditioner disk between a first position in contact with the polishing pad and a second position in a conditioning disk cleaning station;
• and
• after polishing of the substrate, moving the conditioner disk to a third position in a cleaning cup.

A polishing system, comprising:

• a platen to hold a polishing pad;
• a carrier head to hold a substrate against the polishing pad;
• a conditioner including a conditioner head to hold a conditioner disk against the polishing pad;
• a motor to move the conditioner head laterally movable relative to the platen;
• a conditioning disk cleaning station positioned adjacent the platen to clean the conditioner disk;
• and
• a controller configured to cause the motor to, during polishing of the substrate, move the conditioner head back and forth between a first position with the conditioner head over the polishing pad and a second position with the conditioner head in the conditioner disk cleaning station with each sweep of the conditioner head.