Use of steam for pre-heating of CMP components

A chemical mechanical polishing system, comprising:

• a platen to support a polishing pad;
• a sensor to monitor a temperature of the polishing pad;
• a boiler;
• a component that is moveable between a first position spaced from the polishing pad and a second position in contact with the polishing pad;
• a plurality of nozzles to direct heated fluid from the boiler onto the component of the polishing system when located at the first position, wherein said heated fluid comprises steam;
• an actuator to move the component from the first position spaced from the polishing pad to the second position in contact with the polishing pad;
• and
• a controller configured to
• cause the nozzles to direct the heated fluid onto the component to raise a temperature of the component to an elevated temperature that exceeds the temperature of the polishing pad,
• cause the actuator to move the component from the first position into contact with the polishing pad before the component returns to an ambient temperature, and
• cause the temperature of the component to reach the elevated temperature such that the component cools to the same or substantially the same temperature as the polishing pad as the component moves from the first position to the second position.