Pad conditioner cleaning apparatus
AssigneeApplied Materials, Inc.
InventorsRaijiro Koga, Hiromi Tsuruta, Takashi Kumagai, Gee Hoey, Brian J. Brown, Boris Fishkin, Fred C. Redeker, Bruce Lu, Rex Lu, K. Y. Wang, Roland Shu
Life of this patent
Estimating the term…
Abstract
A chemical mechanical polishing apparatus includes a pad conditioner having a conditioner head, a cleaning cup for receiving and cleaning the conditioner head of the pad conditioner, and a fluid dispenser for dispensing a cleaning fluid onto the conditioner head.
Claims34
A chemical mechanical polishing apparatus, comprising:
- a pad conditioner having a conditioner head;
- and
- a cleaning cup having a base and a wall extending upward from the base for receiving and cleaning the conditioner head, the cleaning cup including a spray nozzle to spray a cleaning fluid onto the conditioner head.
A chemical mechanical polishing apparatus, comprising:
- a pad conditioner having a conditioner head;
- a cleaning cup having a base and a wall extending upward from the base for receiving and cleaning the conditioner head;
- and
- a cleaning fluid dispenser positioned to provide a flowing cleaning fluid onto a top side of the conditioner head.
A method of cleaning a chemical mechanical polishing apparatus, comprising:
- placing a pad conditioner including a conditioner head in a cleaning cup;
- and
- providing a cleaning fluid onto a top side of the conditioner head.
A chemical mechanical polishing apparatus, comprising:
- a pad conditioner having a conditioner head;
- a cleaning cup having a base and a wall extending upward from the base for receiving and cleaning the conditioner head;
- and
- a plurality of fluid dispensers to dispense a cleaning fluid onto the conditioner head and at least one part selected from a conditioner head drive shaft and an arm that supports the conditioner head.
A chemical mechanical polishing apparatus, comprising:
- a pad conditioner having a conditioner head;
- a cleaning cup having a base and a wall extending upward from the base for receiving and cleaning the conditioner head;
- and
- a fluid dispenser placed on the base of the cleaning cup to spray a cleaning fluid toward a bottom side of the conditioner head placed in the cleaning cup.
A method of cleaning a chemical mechanical polishing apparatus, comprising the steps of:
- placing a conditioner head of a pad conditioner in a cleaning cup;
- and
- providing a cleaning fluid to the conditioner head and at least one part selected from a conditioner head drive shaft and an arm that supports the conditioner head.
A method of cleaning a chemical mechanical polishing apparatus, comprising:
- placing a pad conditioner including a conditioner head in a cleaning cup;
- and
- providing a cleaning fluid to the conditioner head and a drive shaft of the pad conditioner.
A method of cleaning a chemical mechanical polishing apparatus, comprising:
- placing a pad conditioner including a conditioner head in a cleaning cup;
- and
- providing a cleaning fluid to the conditioner head and an arm of the pad conditioner.
A chemical mechanical polishing apparatus, comprising:
- a pad conditioner having a conditioner head;
- a cleaning cup having a base and a wall extending upward from the base for receiving and cleaning the conditioner head;
- and
- a plurality of fluid dispensers to dispense a cleaning fluid onto the conditioner head and a conditioner head drive shaft.
A chemical mechanical polishing apparatus, comprising:
- a pad conditioner having a conditioner head;
- a cleaning cup having a base and a wall extending upward from the base for receiving and cleaning the conditioner head;
- and
- a plurality of fluid dispensers to dispense a cleaning fluid onto the conditioner head and an arm that supports the conditioner head.
Dependencies are inferred from the claim text.