Substrate polishing device, substrate processing device, method, and storage medium

A substrate polishing device that polishes a substrate by bringing the substrate into sliding contact with a polishing member, the substrate polishing device comprising:

• a dresser configured to dress the polishing member by oscillating on the polishing member, the dresser being capable of adjusting a load and a rotational speed in a plurality of scan areas set on the polishing member in an oscillation direction;
• a height detection unit configured to measure a surface height of the polishing member in a plurality of monitor areas preset on the polishing member in the oscillation direction of the dresser;
• a dress model matrix production unit configured to produce a dress model matrix defined by the plurality of monitor areas, the plurality of scan areas, and a dress model;
• an evaluation index production unit configured to calculate a height profile predicted value by using the dress model and an oscillation speed or a dwell time of the dresser in each scan area and to produce an evaluation index based on a difference from a target value of a height profile of the polishing member;
• and
• a calculation unit configured to calculate the load and the rotational speed of the dresser in each scan area based on the evaluation index.