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US 12,564,914 B2Granted
Grinding apparatus and method for manufacturing semiconductor device using the same
AssigneeSamsung Electronics Co., Ltd.
InventorsJunghyun Roh, Jongguw Kim, Wangsun Lim, Manhee Han, Jaeyoung Hong
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Abstract
A grinding apparatus and a method for manufacturing a semiconductor device using the same are provided. A grinding apparatus includes a chuck unit configured to receive a substrate, a grinding unit on a part of the chuck unit and configured to grind the substrate, and a dressing unit under a part of the grinding unit adjacent to the chuck unit and including a dressing board configured to dress the grinding unit and magnets under the dressing board.
Claims14
A grinding apparatus, comprising:
- a chuck unit configured to receive a substrate;
- a grinding unit configured to be on a part of the chuck unit and further configured to grind the substrate;
- and
- a dressing unit configured to be under a part of the grinding unit adjacent to the chuck unit and to dress the grinding unit,
- wherein the dressing unit includes
- driving parts,
- a dressing board configured to be on the driving parts and to dress the grinding unit, and
- magnets between the dressing board and the driving parts, the magnets configured to generate one or more magnetic fields to float the dressing board from the driving parts using a repulsive force of the one or more magnetic fields,
- wherein the magnets include
- a lower magnet,
- an upper magnet on the lower magnet, and
- a middle magnet between the lower magnet and the upper magnet in a vertical direction, and
- wherein respective poles of each of the middle magnet, the upper magnet, and the lower magnet are aligned in the vertical direction.
10 more elements
A grinding apparatus, comprising:
- a chuck unit including a chuck table configured to receive a substrate;
- a grinding unit including a grinding wheel on the chuck table and grinding tips between the grinding wheel and the chuck table;
- and
- a dressing unit adjacent to the chuck table and configured to dress the grinding tips,
- wherein the dressing unit includes
- an external guiding part,
- driving parts,
- a dressing board on the driving parts, the dressing board configured to dress the grinding tips, and
- magnets, including
- a lower magnet in the external guiding part between the dressing board and the driving parts,
- an upper magnet in the external guiding part between the lower magnet and the dressing board, and
- a middle magnet between the lower magnet and the upper magnet in a vertical direction, and
- wherein respective poles of each of the middle magnet, the upper magnet, and the lower magnet are aligned in the vertical direction.
10 more elements
Dependencies are inferred from the claim text.