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US 2026/0307206 A1Published application
Polishing pad conditioner manufacturing method
AssigneeNippon Alloy co., Ltd.
InventorsPing CHUANG, Ping Hsu CHEN, Bing Je LEE
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Abstract
A polishing pad conditioner manufacturing method includes the following steps: providing a substrate; fixing a plurality of conditioning protrusions onto the substrate by using a bonding layer; providing a protective material; and forming a protective layer on surfaces of the substrate and the conditioning protrusions by using a pulse electroplating process with the protective material.
Claims11
A polishing pad conditioner manufacturing method, comprising:
- providing a substrate;
- fixing a plurality of conditioning protrusions onto the substrate by using a bonding layer;
- providing a protective material;
- and
- forming a protective layer on surfaces of the substrate and the conditioning protrusions by using a pulse electroplating process with the protective material, wherein a pulse amplitude of the pulse electroplating process is approximately 0.1 to 5 amperes, a pulse width of the pulse electroplating process is approximately 1 to 5 seconds, and a low pulse width of the pulse electroplating process is approximately 1 to 5 seconds.
2 more elements
A polishing pad conditioner manufacturing method, comprising:
- providing a substrate;
- fixing a plurality of conditioning protrusions onto the substrate by using a bonding layer;
- providing a protective material;
- and
- forming a protective layer on surfaces of the substrate and the conditioning protrusions by using a pulse electroplating process with the protective material, wherein an operating time of the pulse electroplating process is approximately 0.5 to 3 minutes and a total operating cycle count of the pulse electroplating process is 6 to 18 cycles.
2 more elements
Dependencies are inferred from the claim text.