B24B 53/017
Devices or means for dressing, cleaning or otherwise conditioning lapping tools
B24B53/017 (Devices or means for dressing, cleaning or otherwise conditioning lapping tools) appears on 1,188 US grants and 1,196 published applications in this corpus.
Search patents in B24B- Granted patents
- 1,188
- Published applications
- 1,196
- Assignees
- 312
- Inventors
- 2,155
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 3 | 0 |
| 1993 | 2 | 0 |
| 1994 | 3 | 0 |
| 1995 | 4 | 0 |
| 1996 | 9 | 0 |
| 1997 | 27 | 0 |
| 1998 | 28 | 0 |
| 1999 | 46 | 0 |
| 2000 | 57 | 0 |
| 2001 | 82 | 33 |
| 2002 | 84 | 71 |
| 2003 | 73 | 64 |
| 2004 | 68 | 72 |
| 2005 | 71 | 63 |
| 2006 | 78 | 61 |
| 2007 | 47 | 58 |
| 2008 | 24 | 41 |
| 2009 | 25 | 35 |
| 2010 | 26 | 34 |
| 2011 | 13 | 21 |
| 2012 | 16 | 28 |
| 2013 | 24 | 25 |
| 2014 | 25 | 54 |
| 2015 | 31 | 49 |
| 2016 | 34 | 40 |
| 2017 | 30 | 25 |
| 2018 | 19 | 45 |
| 2019 | 32 | 43 |
| 2020 | 31 | 49 |
| 2021 | 16 | 36 |
| 2022 | 21 | 36 |
| 2023 | 45 | 53 |
| 2024 | 30 | 50 |
| 2025 | 35 | 80 |
| 2026 | 24 | 30 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Conditioner and chemical mechanical polishing apparatus including the same6 Oct 2026US 12,752,393 B2Samsung Electronics Co., Ltd.
- Polishing pad conditioning apparatus29 Sep 2026US 12,746,639 B2Hangzhou Sizone Electronic Technology Inc.
- Method for refreshing polishing pad and method for manufacturing semiconductor device using the same15 Sep 2026US 12,734,640 B2Enpulse Co., Ltd.
- Method and apparatus to clean substrate with atomizing nozzle8 Sep 2026US 12,728,445 B2APPLIED Materials.Inc.
- Substrate suction member, elastic seal assembly, top ring, and substrate processing apparatus8 Sep 2026US 12,728,497 B2Ebara Corporation
- Chemical mechanical polishing temperature scanning apparatus for temperature control8 Oct 2026US 2026/0307202 A1APPLIED Materials.Inc.
- Polishing system having selectable pad conditioner height and related methods8 Oct 2026US 2026/0307204 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Polishing pad conditioner manufacturing method8 Oct 2026US 2026/0307206 A1Nippon Alloy co., Ltd.
- Slurry recycling for chemical mechanical planarazation system8 Oct 2026US 2026/0307209 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Dresser, method of manufacturing dresser, and method of manufacturing semiconductor device27 Aug 2026US 2026/0249425 A1Kioxia Corporation
Most cited
By later US patents
- Continuous processing system for chemical mechanical polishing501US 5,738,574 AAPPLIED Materials.Inc. · 1998
- Method of modifying an exposed surface of a semiconductor wafer335US 5,958,794 AMinnesota Mining and Manufacturing Company · 1999
- Polishing pad conditioning apparatus for wafer planarization process292US 5,216,843 AIntel Corporation · 1993
- Polymeric polishing pad containing hollow polymeric microelements245US 5,578,362 ARodel, Inc. · 1996
- Linear polisher and method for semiconductor wafer planarization187US 5,692,947 AOntrak Systems, Inc. · 1997