B23K 20/025
Bonding tips therefor
Official title: {Bonding tips therefor}
B23K20/025 (Bonding tips therefor) appears on 49 US grants and 25 published applications in this corpus.
Search patents in B23K- Granted patents
- 49
- Published applications
- 25
- Assignees
- 33
- Inventors
- 95
- Latest grant
- 20 Jan 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 2 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 2 | 0 |
| 1995 | 3 | 0 |
| 1996 | 1 | 0 |
| 1997 | 3 | 0 |
| 1998 | 0 | 0 |
| 1999 | 5 | 0 |
| 2000 | 2 | 0 |
| 2001 | 0 | 0 |
| 2002 | 1 | 1 |
| 2003 | 2 | 0 |
| 2004 | 1 | 1 |
| 2005 | 1 | 2 |
| 2006 | 2 | 1 |
| 2007 | 0 | 1 |
| 2008 | 1 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 1 |
| 2014 | 0 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 0 |
| 2017 | 1 | 0 |
| 2018 | 0 | 3 |
| 2019 | 1 | 3 |
| 2020 | 3 | 2 |
| 2021 | 3 | 2 |
| 2022 | 3 | 3 |
| 2023 | 1 | 2 |
| 2024 | 1 | 1 |
| 2025 | 0 | 1 |
| 2026 | 1 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Bonding and indexing method20 Jan 2026US 12,532,763 B2Nexperia B. V.
- Method and apparatus for flexible circuit cable attachment31 Dec 2024US 12,185,476 B2Jabil Inc.
- Method and apparatus for flexible circuit cable attachment19 Sep 2023US 11,765,837 B2Jabil Inc.
- Methods and apparatus for temperature modification and reduction of contamination in bonding stacked microelectronic devices29 Nov 2022US 11,515,171 B2Micron Technology, Inc.
- Bonding head and a bonding apparatus having the same27 Sep 2022US 11,456,273 B2Samsung Electronics Co., Ltd.
- Wire bonding tools, and related methods of providing the same14 May 2026US 2026/0131395 A1Kulicke and Soffa Industries, Inc.
- Thermal compression bonding with contact area adjustment28 Aug 2025US 2025/0273618 A1International Business Machines Corporation
- Method and Apparatus for Flexible Circuit Cable Attachment4 Jan 2024US 2024/0008189 A1Jabil Inc.
- Wire bonding tools, and related methods of providing the same2 Nov 2023US 2023/0347442 A1Kulicke and Soffa Industries, Inc.
- Bond head design for thermal compression bonding5 Oct 2023US 2023/0317676 A1Intel Corporation
Most cited
By later US patents
- Bonding tool and its fabrication107US 5,213,248 ANorton Company · 1993
- High strength bonding tool and a process for production of the same104US 5,934,542 ASumitomo Electric Industries, Ltd. · 1999
- Semiconductor inner lead bonding tool98US 5,390,844 ATessera, Inc. · 1995
- Mounting method and mounting apparatus for electronic part83US 6,543,668 B1Taiyo Yuden Co., Ltd. · 2003
- Bonding tool, production and handling thereof66US 5,425,491 ASumitomo Electric Industries, Ltd. · 1995