B23K 20/023
Thermo-compression bonding
Official title: {Thermo-compression bonding}
B23K20/023 (Thermo-compression bonding) appears on 695 US grants and 660 published applications in this corpus.
Search patents in B23K- Granted patents
- 695
- Published applications
- 660
- Assignees
- 420
- Inventors
- 1,656
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 6 | 0 |
| 1977 | 1 | 0 |
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 4 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 2 | 0 |
| 1985 | 1 | 0 |
| 1986 | 4 | 0 |
| 1987 | 2 | 0 |
| 1988 | 3 | 0 |
| 1989 | 2 | 0 |
| 1990 | 4 | 0 |
| 1991 | 3 | 0 |
| 1992 | 8 | 0 |
| 1993 | 17 | 0 |
| 1994 | 17 | 0 |
| 1995 | 14 | 0 |
| 1996 | 17 | 0 |
| 1997 | 22 | 0 |
| 1998 | 19 | 0 |
| 1999 | 22 | 0 |
| 2000 | 19 | 0 |
| 2001 | 23 | 7 |
| 2002 | 8 | 8 |
| 2003 | 12 | 12 |
| 2004 | 6 | 21 |
| 2005 | 16 | 25 |
| 2006 | 9 | 15 |
| 2007 | 7 | 11 |
| 2008 | 11 | 15 |
| 2009 | 13 | 14 |
| 2010 | 11 | 23 |
| 2011 | 8 | 21 |
| 2012 | 12 | 21 |
| 2013 | 12 | 30 |
| 2014 | 15 | 18 |
| 2015 | 27 | 42 |
| 2016 | 28 | 52 |
| 2017 | 38 | 58 |
| 2018 | 36 | 38 |
| 2019 | 32 | 31 |
| 2020 | 41 | 27 |
| 2021 | 20 | 38 |
| 2022 | 24 | 37 |
| 2023 | 31 | 26 |
| 2024 | 32 | 35 |
| 2025 | 16 | 21 |
| 2026 | 16 | 14 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Cookware with copper bonded layer29 Sep 2026US 12,745,872 B2All-Clad Metalcrafters LLC
- Golf club face plates with internal cell lattices and related methods15 Sep 2026US 12,734,413 B2Karsten Manufacturing Corporation
- Method for joining metal materials and controlling bonding quality thereof25 Aug 2026US 12,715,061 B2Toyama Prefecture
- Method and device for pressure sintering connection18 Aug 2026US 12,708,956 B2Semikron Elektronik GmbH & Co. KG
- Electronic device having a soldered joint between a metal region of a semiconductor die and a metal region of a substrate21 Jul 2026US 12,690,481 B2Infineon Technologies Austria AG
- Titanium Laminate, and Method for Producing Titanium Laminate27 Aug 2026US 2026/0249583 A1Toho Titanium Co., Ltd.
- Aluminum alloy plate and method for producing same6 Aug 2026US 2026/0225140 A1Uacj Corporation
- Alignment method of semiconductor chip, bonding method, semiconductor device, and electronic component manufacturing system30 Jul 2026US 2026/0223729 A1Tohoku University
- Method for manufacturing shower head for semiconductor manufacturing using an improved diffusion bonding process23 Jul 2026US 2026/0208284 A1Tnp Corporation
- Components and the manufacture thereof via welding with reduced alloy-depletion16 Jul 2026US 2026/0199974 A1
Most cited
By later US patents
- Laser processing method and laser processing apparatus293US 6,992,026 B2Hamamatsu Photonics K.K. · 2006
- Complete device layer transfer without edge exclusion via direct wafer bonding and constrained bond-strengthening process238US 6,908,027 B2Intel Corporation · 2005
- Method of fabrication of a AL/GE bonding in a wafer packaging environment and a product produced therefrom155US 7,442,570 B2Invensence Inc. · 2008
- Method and apparatus for a combined mechanical and metallurgical connection139US 6,419,147 B12002
- Laser processing method for cutting a wafer-like object by using a laser to form modified regions within the object117US 7,396,742 B2Hamamatsu Photonics K.K. · 2008