Method for manufacturing shower head for semiconductor manufacturing using an improved diffusion bonding process

A method for manufacturing a shower head for semiconductor manufacturing, the method comprising:

• performing a first diffusion bonding step (S1) of bonding an end plate and a middle plate using diffusion bonding to manufacture a lower structure;
• and
• performing a second diffusion bonding step (S2) of bonding a top plate to the lower structure using diffusion bonding to manufacture the shower head,
• wherein the end plate, the middle plate, and the top plate are formed of aluminum or an aluminum alloy,
• wherein the first diffusion bonding step (S1) comprises:
• a first preparation step (S1-1) of stacking the middle plate on the end plate and fixing the stacked plates in a work chamber for diffusion bonding;
• a first preheating step (S1-2) of applying heat and pressure to the end plate and the middle plate to create an environment for atomic movement;
• a first stabilization step (S1-3) of applying heat and pressure to a bonding surface of the end plate and the middle plate to improve bonding quality;
• and
• a first bonding step (S1-4) of bonding the end plate and the middle plate by applying heat and pressure to the bonding surface, and
• wherein the first bonding step (S1-4) includes manufacturing the lower structure by:
• raising a temperature inside the work chamber to 0.86 to 0.94 times a melting point of the end plate and the middle plate while applying a pressure of 2.7 to 7.4 MPa to the bonding surface;
• maintaining the pressure and the temperature for 140 to 160 minutes;
• and
• subsequently cooling the temperature inside the work chamber to room temperature for 200 to 280 minutes while rapidly releasing the pressure for 10 to 20 minutes.