B23K 20/02
Non-electric welding by applying impact or other pressure, with or without the
Official title: by means of a press {; Diffusion bonding}
B23K20/02 (Non-electric welding by applying impact or other pressure, with or without the) appears on 1,179 US grants and 1,135 published applications in this corpus.
Search patents in B23K- Granted patents
- 1,179
- Published applications
- 1,135
- Assignees
- 674
- Inventors
- 2,738
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 11 | 0 |
| 1977 | 9 | 0 |
| 1978 | 5 | 0 |
| 1979 | 1 | 0 |
| 1980 | 2 | 0 |
| 1981 | 8 | 0 |
| 1982 | 2 | 0 |
| 1983 | 2 | 0 |
| 1984 | 7 | 0 |
| 1985 | 4 | 0 |
| 1986 | 13 | 0 |
| 1987 | 6 | 0 |
| 1988 | 9 | 0 |
| 1989 | 10 | 0 |
| 1990 | 7 | 0 |
| 1991 | 8 | 0 |
| 1992 | 17 | 0 |
| 1993 | 28 | 0 |
| 1994 | 26 | 0 |
| 1995 | 19 | 0 |
| 1996 | 18 | 0 |
| 1997 | 26 | 0 |
| 1998 | 26 | 0 |
| 1999 | 34 | 0 |
| 2000 | 31 | 0 |
| 2001 | 30 | 8 |
| 2002 | 18 | 16 |
| 2003 | 18 | 15 |
| 2004 | 14 | 31 |
| 2005 | 22 | 38 |
| 2006 | 12 | 36 |
| 2007 | 11 | 24 |
| 2008 | 15 | 26 |
| 2009 | 20 | 29 |
| 2010 | 20 | 40 |
| 2011 | 19 | 47 |
| 2012 | 21 | 39 |
| 2013 | 33 | 56 |
| 2014 | 30 | 42 |
| 2015 | 42 | 77 |
| 2016 | 48 | 81 |
| 2017 | 59 | 88 |
| 2018 | 61 | 63 |
| 2019 | 61 | 59 |
| 2020 | 64 | 42 |
| 2021 | 32 | 59 |
| 2022 | 33 | 59 |
| 2023 | 47 | 47 |
| 2024 | 57 | 52 |
| 2025 | 32 | 37 |
| 2026 | 31 | 24 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Cookware with copper bonded layer29 Sep 2026US 12,745,872 B2All-Clad Metalcrafters LLC
- Coil manufacturing apparatus, and coil manufacturing method29 Sep 2026US 12,749,621 B2Aster Co., Ltd.
- Golf club face plates with internal cell lattices and related methods15 Sep 2026US 12,734,413 B2Karsten Manufacturing Corporation
- Conductive sheet application process and conductive sheet assembly15 Sep 2026US 12,734,602 B2East Penn Manufacturing Co.
- Joining apparatus15 Sep 2026US 12,734,609 B2Tazmo Co., Ltd.
- Direct bonding24 Sep 2026US 2026/0293756 A1Daicel Corporation
- Titanium Laminate, and Method for Producing Titanium Laminate27 Aug 2026US 2026/0249583 A1Toho Titanium Co., Ltd.
- Aluminum alloy plate and method for producing same6 Aug 2026US 2026/0225140 A1Uacj Corporation
- Printed circuit heat exchanger and methods of fabricating same30 Jul 2026US 2026/0216815 A1GE Vernova Infrastructure Technology LLC
- Alignment method of semiconductor chip, bonding method, semiconductor device, and electronic component manufacturing system30 Jul 2026US 2026/0223729 A1Tohoku University
Most cited
By later US patents
- Laser processing method and laser processing apparatus293US 6,992,026 B2Hamamatsu Photonics K.K. · 2006
- Complete device layer transfer without edge exclusion via direct wafer bonding and constrained bond-strengthening process238US 6,908,027 B2Intel Corporation · 2005
- Room temperature metal direct bonding236US 8,524,533 B2Ziptronix, Inc. · 2013
- Room temperature metal direct bonding220US 9,385,024 B2Ziptronix, Inc. · 2016
- Method for room temperature metal direct bonding189US 6,962,835 B2Ziptronix, Inc. · 2005