Conductive sheet application process and conductive sheet assembly
AssigneeEast Penn Manufacturing Co.
InventorThomas Faust, Jr.
Life of this patent
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Abstract
A process of applying a conductive material to a substrate includes positioning a plurality of first conductive sheets between the substrate and a second conductive sheet. The first conductive sheets are heated to melt the first conductive sheets. The first conductive sheets have a lower melting point than the substrate and the second conductive sheet; the substrate and the second conductive sheet remain in a solid state when the first conductive sheets melt. A force is applied on the second conductive sheet toward the substrate, and the first conductive sheets are cooled to an attached state in which the first conductive sheets mechanically connect the second conductive sheet with the substrate.
Claims12
A conductive sheet assembly, comprising:
- a substrate;
- a plurality of first conductive sheets disposed on the substrate, the first conductive sheets are each formed of a solder material;
- and
- a second conductive sheet disposed on the first conductive sheets, the second conductive sheet is a lead foil, the first conductive sheets each have a lower melting point than the second conductive sheet and mechanically connect the second conductive sheet to the substrate.
Dependencies are inferred from the claim text.