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US 2026/0293756 A1Published application
Direct bonding
AssigneesOkuno Chemical Industries Co., Ltd., The University of Osaka, Daicel Corporation
InventorsHiroki Seto, Kei Hashizume, Yuka Iwamoto, Norihiko Hasegawa, Ryuji Yoshida, Zheng Zhang, Katsuaki Suganuma, Aiji Suetake, Akihiko Happoya
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Abstract
The present invention aims to provide a novel technique for producing a bonded structure using direct bonding. Provided is a bonded structure including a structure 1 and a structure 2 that are bonded together with a metal-plated film therebetween.
Claims4
A bonded structure comprising a structure 1 and a structure 2 that are bonded together with a metal-plated film therebetween.
A method for producing a bonded structure, the method comprising:
- (1) a step of forming a metal-plated film 1 on a structure 1;
- (2) a step of forming a metal-plated film 2 on a structure 2;
- (3) a step of stacking the structure 1 and the structure 2 in such a manner that
- (i) the metal-plated film 1 formed in step (1) and the metal-plated film 2 formed in step (2) are in contact with each other, or
- (ii) the metal-plated film 1 formed in step (1) and the metal-plated film 2 formed in step (2) are between the structures, whereby
- (iii) the structure 1 and the structure 2 are stacked face-to-face;
- and
- (4) a step of heating the stack formed in step (3) to directly bond the metal-plated film 1 and the metal-plated film 2 together.
5 more elements
Dependencies are inferred from the claim text.