Method and device for pressure sintering connection
AssigneeSemikron Elektronik GmbH & Co. KG
InventorsDominic Birkicht, Matthias Dörrich, Silke Kraft, Erik Michaelsen
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AssigneeSemikron Elektronik GmbH & Co. KG
InventorsDominic Birkicht, Matthias Dörrich, Silke Kraft, Erik Michaelsen
Estimating the term…
A method and a device for pressure sintering connection of a joining group composed of a first and a second joining partner by means of a device with a lower tool and an upper tool having the steps: providing the joining group at room temperature as an initial temperature, arranging the joining group between the supporting surface and the pressure surface, wherein the joining group has no direct thermal contact with the supporting surface and no direct thermal contact with the pressure surface, introducing pressure onto the joining group, wherein at the start of the introduction of pressure the starting temperature of the joining group is no more than 100K above an initial temperature; increasing the temperature of the sintering agent by at least 50K above the starting temperature; ending the introduction of pressure.
A method for pressure sintering connection of a joining group composed of a first and a second joining partner by means of a pressure sintering device with a lower tool and an upper tool which are formed to exert a pressure of more than 5 MPa on the joining group which is arranged between a supporting surface of the lower tool and a pressure surface of the upper tool;
Dependencies are inferred from the claim text.