B23K 20/026
With diffusion of soldering material
Official title: {with diffusion of soldering material}
B23K20/026 (With diffusion of soldering material) appears on 111 US grants and 148 published applications in this corpus.
Search patents in B23K- Granted patents
- 111
- Published applications
- 148
- Assignees
- 87
- Inventors
- 319
- Latest grant
- 21 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2003 | 1 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 1 |
| 2011 | 1 | 1 |
| 2012 | 1 | 1 |
| 2013 | 0 | 4 |
| 2014 | 1 | 6 |
| 2015 | 1 | 11 |
| 2016 | 9 | 18 |
| 2017 | 14 | 20 |
| 2018 | 9 | 13 |
| 2019 | 5 | 6 |
| 2020 | 11 | 8 |
| 2021 | 10 | 19 |
| 2022 | 8 | 16 |
| 2023 | 15 | 6 |
| 2024 | 16 | 13 |
| 2025 | 6 | 4 |
| 2026 | 3 | 1 |
By publication year. 2026 runs to 8 Oct.
Recent patents
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- Method for diffusion bonding nickel alloys and austenitic stainless steel5 Jun 2025US 2025/0178120 A1
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Most cited
By later US patents
- Diffusion bonding of copper sputtering targets to backing plates using nickel alloy interlayers43US 6,619,537 B1Tosoh SMD, Inc. · 2003
- Processes and tooling associated with diffusion bonding the periphery of a cavity-back airfoil22US 10,913,133 B2Raytheon Technologies Corporation · 2021
- Thermal compression bonding process cooling manifold10US 9,282,650 B2Intel Corporation · 2016
- Turbine blisk including ceramic matrix composite blades and methods of manufacture8US 10,280,768 B2Rolls-Royce High Temperature Composites Inc. · 2019
- Integrate rinse module in hybrid bonding platform7US 9,446,467 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016