Head for ejecting reactive gas for film formation and method for manufacturing the same
AssigneeNHK Spring Co., Ltd.
InventorsYoshihito ARAKI, Noriyoshi KANEDA
Life of this patent
Estimating the term…
Abstract
Disclosed is a method for manufacturing a head including: diffusion-bonding a first plate and a second plate to each other; and forming, after the diffusion bonding, a nickel-containing film on surfaces of the first plate and the second plate with electroless plating. The first plate and the second plate are configured to have a channel through which the reactive gas passes from a side of the first plate to a side of the second plate in a state where the first plate and the second plate are bonded.
Claims14
A method for manufacturing a head for ejecting a reactive gas for film formation, the method comprising:
- diffusion-bonding a first plate and a second plate to each other;
- and
- forming, after the diffusion bonding, a nickel-containing film on surfaces of the first plate and the second plate with electroless plating,
- wherein the first plate and the second plate are configured to have a channel through which the reactive gas passes from a side of the first plate to a side of the second plate in a state
- where the first plate and the second plate are bonded.
A method for manufacturing a head for ejecting a reactive gas for film formation, the method comprising:
- forming a nickel-containing film on surfaces of a first plate and a second plate with electroless plating;
- and
- diffusion-bonding the first plate and the second plate to each other after the formation of the nickel-containing film,
- wherein the first plate and the second plate are configured to have a channel through which the reactive gas passes from a side of the first plate to a side of the second plate in a state where the first plate and the second plate are bonded.
7-9. (canceled)
A head for ejecting a reactive gas for film formation, the head comprising:
- a first plate;
- a second plate diffusion-bonded to the first plate;
- and
- a nickel-containing film covering surfaces of the first plate and the second plate,
- wherein the first plate and the second plate are configured to have a channel through which the reactive gas passes from a side of the first plate to a side of the second plate.
A head for ejecting a reactive gas for film formation, the head comprising a first plate and a second plate each coated with a nickel-containing film,
- wherein the first plate and the second plate are bonded to each other through a first bonding layer in contact with the first plate and the second plate,
- the first bonding layer consists of the nickel-containing films of the first plate and the second plate, and
- the first plate and the second plate are configured to have a channel through which the reactive gas passes from a side of the first plate to a side of the second plate.
16-18. (canceled)
Dependencies are inferred from the claim text.