Thermal compression bonding process cooling manifold

A thermal compression bonding process system for creating a solder joint in an integrated circuit module, the system comprising:

• a cooling manifold comprising:
• a pre-mixing chamber coupled to a plurality of cooling fluid inlets;
• a mixing chamber having an input that slants towards an output;
• and
• a baffle coupled between the pre-mixing chamber and the input of the mixing chamber wherein the baffle comprises a plurality of concentric patterns formed through the baffle such that the cooling fluid in the pre-mixing chamber is substantially evenly distributed into the mixing chamber;
• a cooling block coupled to the output of the mixing chamber, the cooling block comprising a plurality of fluid in holes and a plurality of fluid out holes;
• a heater coupled to the cooling block and configured to generate a temperature for melting solder, wherein a channel between the cooling block and the heater enables the cooling fluid from the plurality of fluid in holes to contact the heater and leave the channel through the plurality of fluid out holes;
• and
• a nozzle coupled to the heater, the nozzle configured to distribute a vacuum force.